Abstract: An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n?1 and N?2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.

Abstract: A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.

Abstract: An inductor including a primary coil coaxially arranged and operated in parallel with isolated secondary coils each including at least one loop winding with two open-circuited ports. At least one phase shifting device is arranged between open-circuited ports of at least one secondary coil. A method to operate an inductor by combining primary and secondary coils with phase shifting devices to get a wide tuning range is also provided. The method includes the step of phase shifting open-circuited ports of at least one secondary coil.

Abstract: A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: A system comprises an interposer positioned between an integrated circuit and a system planar. An electrical/optical transceiver is coupled to the interposer, wherein the electrical/optical transceiver converts electrical signals into optical signals. The interposer comprises a first set of electrical conductors that is electrically coupled to non-Input/Output (I/O) electrical connectors on the integrated circuit, and wherein the first set of electrical conductors passes through the interposer to directly connect the non-I/O electrical connectors on the integrated circuit to the system planar. The interposer further comprises a second set of electrical conductors that is electrically coupled to input/output (I/O) electrical connectors on the integrated circuit, wherein the second set of electrical conductors traverses through the interposer to the electrical/optical transceiver to convert electrical I/O signals from the integrated circuit into optical I/O signals.

Abstract: A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.

Abstract: An inductor including a primary coil coaxially arranged and operated in parallel with isolated secondary coils each including at least one loop winding with two open-circuited ports. At least one phase shifting device is arranged between open-circuited ports of at least one secondary coil. A method to operate an inductor by combining primary and secondary coils with phase shifting devices to get a wide tuning range is also provided. The method includes the step of phase shifting open-circuited ports of at least one secondary coil.

Abstract: An inductor including a primary coil coaxially arranged and operated in parallel with isolated secondary coils each including at least one loop winding with two open-circuited ports. At least one phase shifting device is arranged between open-circuited ports of at least one secondary coil. A method to operate an inductor by combining primary and secondary coils with phase shifting devices to get a wide tuning range is also provided. The method includes the step of phase shifting open-circuited ports of at least one secondary coil.

Abstract: An electrostatic discharge (ESD) protection device for protecting an I/O port of an electronic circuit from overvoltage and a coil structure for use in an ESD protection device. The ESD protection device includes: a plurality of inductors that are serially coupled in a line, where a node is formed between two neighboring inductors; and a plurality of protection arrangements adapted to conduct charges to one provided potential when an overvoltage is applied, where each of the protection arrangements is connected with one of the nodes, and where the serially coupled inductors are magnetically coupled with each other.

Abstract: An electrostatic discharge (ESD) protection device for protecting an I/O port of an electronic circuit from overvoltage and a coil structure for use in an ESD protection device. The ESD protection device includes: a plurality of inductors that are serially coupled in a line, where a node is formed between two neighboring inductors; and a plurality of protection arrangements adapted to conduct charges to one provided potential when an overvoltage is applied, where each of the protection arrangements is connected with one of the nodes, and where the serially coupled inductors are magnetically coupled with each other.

Abstract: The invention is directed to a device (10, 10a-10d) comprising: a set of on-chip circuits (110-160, 170, 180), each of the circuits configured to generate a magnetic field (300) perpendicular to a planar surface of the set when energized; a ferrofluidic layer (40) interfaced to the planar surface; and a logic circuit (50) configured to selectively energize (200, 200a) one ore more circuits of the set such as to generate a magnetic field at the energized circuits and a deformation (41, 44, 45) of the ferrofluidic layer in response thereto and to modulate optical beams (IR1, IR2) directed to the ferrofluid layer. Preferably, an additional liquid layer (60) is interfaced to the ferrofluid layer, opposite to the on-chip circuits, which is not miscible with the ferrofluid layer. The invention can be applied to micro-display/projection devices, programmable optical reflecting lenses, or to micro-molding applications for surface replication.

Abstract: An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.

Abstract: A polymer waveguide including a polymer matrix and particles, wherein the particles are embedded in the polymer matrix and have lower optical bulk losses than the polymer matrix.

Abstract: An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n?1 and N?2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.

Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: A continuously tunable inductor with an inductive-capacitive (LC) voltage controlled oscillator (VCO) having a primary coil. The inductor includes a separate isolated secondary coil, a set of transistors composing a closed loop with the secondary coil, a magnetic coupling between the primary coil of the LC VCO and the secondary coil, an electrical coupling between the LC VCO and the set of transistors composing a closed loop with the secondary coil, and means for electric current injection into the closed loop. Such an inductor can be tuned by modulating a mutual inductance, which is magnetically and electrically coupled with the LC VCO by injection of an electric current (I0).

Abstract: An inductor and method of operating the inductor by combining primary and secondary coils with passive coupling, active parallel, or active cross-coupling structures. The first includes at least one passive coupling structure having at least one coupling coil arranged between a primary coil and at least one of the secondary coils and/or between two of the secondary coils. The second includes an active coupling structure arranged between a primary coil and at least one secondary coil and/or between at least two of the secondary coils, to selectively parallel couple the primary coil and one of the secondary coils and/or at least two of the secondary coils. The third includes an active coupling structure to selectively cross couple a primary coil and at least one of the secondary coils and/or to selectively cross couple at least two of the secondary coils.

Abstract: A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.

Abstract: A photo detector device comprising a first layer comprising a first material, and a second layer arranged adjacent to the first layer, the second layer comprising strained silicon, wherein the second layer further comprises a light absorption region located substantially within the strained silicon, wherein the first or the second layer is arranged on a substrate.

Abstract: A photo detector comprising a grating (PC). The grating (PC) is arranged on top of a surface of an active semiconductor layer. The grating (PC) is patterned in uninterrupted first strips (ST1), that are arranged in a first direction (x) in a first predetermined interval (a), and second strips (ST2), that are arranged in a second direction (y) in a second predetermined interval (b). The second strips (ST2) each comprise at least one interruption in a region between each two neighboring first strips (ST1) in form of a predetermined gap (d). Positively doped regions (P) and negatively doped regions (N) each are arranged as strips in parallel with the first strips (ST1) such that in a region between each two neighboring first strips (ST1) alternately either one of the positively doped regions (P) or one of the negatively doped regions (N) is arranged.