Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Connector receptacles that are arranged to avoid inadvertent connections. One example may provide contacts for a first connector receptacle that may be located behind a movable gate. The first connector receptacle may be combined with a second connector receptacle that is user accessible to save space and simplify device assembly. Combining the first connector receptacle and a second connector receptacle may also remove the movable gate from a surface of an electronic device, thereby further preventing inadvertent connections.

Abstract: Connector receptacles that are arranged to avoid inadvertent connections. One example may provide contacts for a first connector receptacle that may be located behind a movable gate. The first connector receptacle may be combined with a second connector receptacle that is user accessible to save space and simplify device assembly. Combining the first connector receptacle and a second connector receptacle may also remove the movable gate from a surface of an electronic device, thereby further preventing inadvertent connections.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: A network device and method for improving performance monitoring capabilities using wide view angle indicators are disclosed. The network device or system, in one embodiment, includes a first plate, a second plate, and a first light source. The first plate includes an edge lip or lip containing a graphic viewing surface. Various ultraviolet (“UV”) inked icons indicating functional performance are inscribed in or on the graphic viewing surface. The second plate is situated substantially perpendicular to the first plate, wherein an edge of the second plate is positioned adjacent to the graphic viewing surface. The first light source is configured to selectively project a UV light onto at least a portion of the graphic viewing surface to active at least one UV inked icon.