Abstract: Disclosed is a method and apparatus for ultrasonic testing using TSF (Temporal Sparse Firing). For each position of a plurality of positions of a phased array ultrasonic probe, an ultrasonic wave is transmitted into an object using a defined subset of transducer elements and propagation of the ultrasonic wave in the object is observed using receiving elements of the transducer elements to produced raw image data for the position, such that the defined subset changes for adjacent positions of the ultrasonic phased array probe. The raw image data of each position is combined to produce an ultrasonic image of the object. Notably, the ultrasonic image can be produced faster than traditional FMC (Full Matrix Capture) approaches because only a subset of the transducer elements transmit at each position. Meanwhile, diversity provided by the defined subset changing for adjacent positions can mitigate reduction in image quality as in traditional sparse firing.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.

Abstract: An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Connector receptacles that are arranged to avoid inadvertent connections. One example may provide contacts for a first connector receptacle that may be located behind a movable gate. The first connector receptacle may be combined with a second connector receptacle that is user accessible to save space and simplify device assembly. Combining the first connector receptacle and a second connector receptacle may also remove the movable gate from a surface of an electronic device, thereby further preventing inadvertent connections.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Connector receptacles that are arranged to avoid inadvertent connections. One example may provide contacts for a first connector receptacle that may be located behind a movable gate. The first connector receptacle may be combined with a second connector receptacle that is user accessible to save space and simplify device assembly. Combining the first connector receptacle and a second connector receptacle may also remove the movable gate from a surface of an electronic device, thereby further preventing inadvertent connections.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: A network device and method for improving performance monitoring capabilities using wide view angle indicators are disclosed. The network device or system, in one embodiment, includes a first plate, a second plate, and a first light source. The first plate includes an edge lip or lip containing a graphic viewing surface. Various ultraviolet (“UV”) inked icons indicating functional performance are inscribed in or on the graphic viewing surface. The second plate is situated substantially perpendicular to the first plate, wherein an edge of the second plate is positioned adjacent to the graphic viewing surface. The first light source is configured to selectively project a UV light onto at least a portion of the graphic viewing surface to active at least one UV inked icon.