Patents by Inventor Jonathan Alan Orth

Jonathan Alan Orth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and system for flattening secondary edgebeads on resist coated wafers
    Patent number: 6184156
    Abstract: A method and system of flattening resist mounds formed during a wet edgebead operation. The wet edgebead operation is used to remove edgebeads formed when a resist material is deposited on a semiconductor wafer. Solvent is introduced to the semiconductor wafer at the area containing the resist mounds to soften them, and the semiconductor wafer is spun at a high speed to flatten the mounds.
    Type: Grant
    Filed: December 12, 1997
    Date of Patent: February 6, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Jonathan Alan Orth
  • Process and system for flattening secondary edgebeads on resist coated wafers
    Patent number: 6001542
    Abstract: A method and system of flattening resist mounds formed during a wet edgebead operation. The wet edgebead operation is used to remove edgebeads formed when a resist material is deposited on a semiconductor wafer. Solvent is introduced to the semiconductor wafer at the area containing the resist mounds to soften them, and the semiconductor wafer is spun at a high speed to flatten the mounds.
    Type: Grant
    Filed: December 12, 1997
    Date of Patent: December 14, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Jonathan Alan Orth
  • Process and system for flattening secondary edgebeads on resist coated wafers
    Patent number: 5911090
    Abstract: A method and system of flattening resist mounds formed during a wet edgebead operation. The wet edgebead operation is used to remove edgebeads formed when a resist material is deposited on a semiconductor wafer. Solvent is introduced to the semiconductor wafer at the area containing the resist mounds to soften them, and the semiconductor wafer is spun at a high speed to flatten the mounds.
    Type: Grant
    Filed: December 12, 1997
    Date of Patent: June 8, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Jonathan Alan Orth
  • Process and system for flattening secondary edgebeads on resist coated wafers
    Patent number: 5874202
    Abstract: A method and system of flattening resist mounds formed during a wet edgebead operation. The wet edgebead operation is used to remove edgebeads formed when a resist material is deposited on a semiconductor wafer. Solvent is introduced to the semiconductor wafer at the area containing the resist mounds to soften them, and the semiconductor wafer is spun at a high speed to flatten the mounds.
    Type: Grant
    Filed: December 12, 1997
    Date of Patent: February 23, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Jonathan Alan Orth
  • Process and system for flattening secondary edgebeads on resist coated wafers
    Patent number: 5750317
    Abstract: A method and system of flattening resist mounds formed during a wet edgebead operation. The wet edgebead operation is used to remove edgebeads formed when a resist material is deposited on a semiconductor wafer. Solvent is introduced to the semiconductor wafer at the area containing the resist mounds to soften them, and the semiconductor wafer is spun at a high speed to flatten the mounds.
    Type: Grant
    Filed: September 16, 1994
    Date of Patent: May 12, 1998
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Jonathan Alan Orth