Abstract: An extruded butter stick product includes a plurality of pre-defined portions successively connected lengthwise to an adjacent portion by a connecting bridge, each bridge comprising a height that is at least 15% and up to 50% of the total height of the butter stick. Sidewalls of the successively connected portions define at least one trough leading to the bridge. Sidewalls may provide a surface for gripping one of the portions, and a bridge may define a fulcrum for breaking a portion from the butter stick such that each portion of the butter stick can be individually separated from the butter stick at the bridge. Alternatively, sidewalls and the connecting bridge may provide a guide for cutting the pre-defined portions. The butter sticks may be produced by an extruder and/or an extruder die defining an aperture with teeth for defining the troughs and connecting bridges in the butter stick.

Abstract: An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.

Abstract: An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.

Abstract: An extruded butter stick product includes a plurality of pre-defined portions successively connected lengthwise to an adjacent portion by a connecting bridge, each bridge comprising a height that is at least 15% and up to 50% of the total height of the butter stick. Sidewalls of the successively connected portions define at least one trough leading to the bridge. Sidewalls may provide a surface for gripping one of the portions, and a bridge may define a fulcrum for breaking a portion from the butter stick such that each portion of the butter stick can be individually separated from the butter stick at the bridge. Alternatively, sidewalls and the connecting bridge may provide a guide for cutting the pre-defined portions. The butter sticks may be produced by an extruder and/or an extruder die defining an aperture with teeth for defining the troughs and connecting bridges in the butter stick.

Abstract: Provided herein are Streptomyces isolates, designated MH71 and MH243, cultures thereof, and compositions comprising the same. Also provided are uses of the isolates, cultures and compositions, for example, for treating and preventing infections and diseases caused by or associated with plant pathogen infections, reducing the susceptibility of plants to diseases caused by or associated with plant pathogen infections, and for inhibiting or reducing the growth of pathogens on plants.

Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.

Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.