Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.

Abstract: A customization control system includes, and a method, applies reprogramming a logic device by means user actuated elements of an electrically integrated system. The logic device only accepts reprogramming when the system is in a safe mode, e.g., in a non-operating state. One version is applied as an after market kit that avoids aspects of a factory-supplied control system, wherein a controller is communicatively coupled with both one or more user actuated input elements and one or more output elements, whereby the controller directs the behavior of the output elements in response to signals received from the user actuated input elements and without intermediation of a native control system of a comprising product or system. The controller may be programmed with a default mode and/or an override priority, whereby the behavior and/or state of the output elements is directed by the controller without regard to reprogrammed instructions.