Abstract: A low-temperature solder (LTS) cap on solder bumps on a substrate and/or solder bumps on a die may improve head-and-pillow open defects. In some examples, the LTS cap melts earlier than the substrate-side or die-side solder during a TCB process, creating a capillary bridge of molten LTS between the die-side solder and substrate-side solder. In one such example, the molten LTS capillary bridge connecting the die-side and substrate-side bumps may improve the heat transfer to the substrate-side solder and significantly reduce or eliminate head-and-pillow open defects.

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.