Patents by Inventor Jonathan Barak Flowers

Jonathan Barak Flowers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11392130
    Abstract: Autonomous ground vehicles equipped with one or more sensors may capture data regarding ground conditions at a location. The data may refer to or describe slopes, surface textures, terrain features, weather conditions, moisture contents or the like at the location, and may be used to select one or more areas for receiving a delivery of an item. The sensors may include one or more inclinometers, imaging devices or other systems. The autonomous ground vehicles may also engage in one or more direct interactions or communications with a delivery vehicle, and may select an appropriate area that is suitable for such interactions. The autonomous ground vehicles may also prepare the area for an arrival of a delivery vehicle, such as by making one or more visible markings in ground surfaces at the area.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: July 19, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Philippe Desrosiers, Jonathan Barak Flowers, Nicholas K. Gentry, Ramsey P. Gill, Camerin Hahn, Ian Beck Jordan, Liam S C Pingree
  • Patent number: 11062824
    Abstract: Fluidic channels and pumps for active cooling of cables are described. One cable assembly includes a conductor having a length between a first end of the cable and a second end of the cable and a fluidic channel structure that at least partially surrounds the conductor along the length of the conductor. A first pump connector is coupled to a first end of the fluidic channel structure and a second pump connector is coupled to a second end of the fluidic channel structure. Motion of liquid metal, when pumped through the fluidic channel structure, distributes heat away from the conductor.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 13, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Jonathan Barak Flowers, Herbert Mehnert
  • Patent number: 11054193
    Abstract: A vehicle such as an unmanned aerial vehicle (UAV) can include a heat-generating electronic device coupled with a heat exhaust element by a vibration isolating thermal connector. The thermal connector includes a first heat-conducting element configured to draw heat from the electronic device, a second heat-conducting element separated from the first heat-conducting element, and a flexible seal connected with the first and second heat-conducting elements and defining an enclosed cavity between the elements. The enclosed cavity contains a heat conducting liquid, and allows limited movement of the first and second heat conducting elements with respect to each other while maintaining thermal connection.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 6, 2021
    Assignee: Amazon Technologies, Inc.
    Inventor: Jonathan Barak Flowers
  • Patent number: 10912224
    Abstract: A vibration isolating thermally conductive connector includes a first thermally conductive element configured to draw heat from a heat source, a second thermally conductive element separated from the first thermally conductive element, and a flexible seal connected with the first and second thermally conductive elements and defining an enclosed cavity between the elements. The enclosed cavity contains a thermally conductive liquid, and allows limited movement of the second and first thermally conductive elements with respect to each other while maintaining thermal connection.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: February 2, 2021
    Assignee: Amazon Technologies, Inc.
    Inventor: Jonathan Barak Flowers
  • Patent number: 10660199
    Abstract: Microfluidic channels and pumps for active cooling of circuit boards are described. One circuit board includes a substrate and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel. Liquid metal is disposed in the microfluidic channel and a pump pumps the liquid metal through the microfluidic channel to actively cool at least a portion of the circuit board.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: May 19, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Jonathan Barak Flowers, Herbert Mehnert
  • Publication number: 20200137885
    Abstract: Microfluidic channels and pumps for active cooling of circuit boards are described. One circuit board includes a substrate and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel. Liquid metal is disposed in the microfluidic channel and a pump pumps the liquid metal through the microfluidic channel to actively cool at least a portion of the circuit board.
    Type: Application
    Filed: October 30, 2018
    Publication date: April 30, 2020
    Inventors: Jonathan Barak Flowers, Herbert Mehnert
  • Publication number: 20200135365
    Abstract: Fluidic channels and pumps for active cooling of cables are described. One cable assembly includes a conductor having a length between a first end of the cable and a second end of the cable and a fluidic channel structure that at least partially surrounds the conductor along the length of the conductor. A first pump connector is coupled to a first end of the fluidic channel structure and a second pump connector is coupled to a second end of the fluidic channel structure. Motion of liquid metal, when pumped through the fluidic channel structure, distributes heat away from the conductor.
    Type: Application
    Filed: October 30, 2018
    Publication date: April 30, 2020
    Inventors: Jonathan Barak Flowers, Herbert Mehnert
  • Publication number: 20190373769
    Abstract: A vibration isolating thermally conductive connector includes a first thermally conductive element configured to draw heat from a heat source, a second thermally conductive element separated from the first thermally conductive element, and a flexible seal connected with the first and second thermally conductive elements and defining an enclosed cavity between the elements. The enclosed cavity contains a thermally conductive liquid, and allows limited movement of the second and first thermally conductive elements with respect to each other while maintaining thermal connection.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 5, 2019
    Inventor: Jonathan Barak Flowers
  • Publication number: 20190368826
    Abstract: A vehicle such as an unmanned aerial vehicle (UAV) can include a heat-generating electronic device coupled with a heat exhaust element by a vibration isolating thermal connector. The thermal connector includes a first heat-conducting element configured to draw heat from the electronic device, a second heat-conducting element separated from the first heat-conducting element, and a flexible seal connected with the first and second heat-conducting elements and defining an enclosed cavity between the elements. The enclosed cavity contains a heat conducting liquid, and allows limited movement of the first and second heat conducting elements with respect to each other while maintaining thermal connection.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 5, 2019
    Inventor: Jonathan Barak Flowers