Patents by Inventor Jonathan Brick

Jonathan Brick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070153065
    Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.
    Type: Application
    Filed: January 4, 2006
    Publication date: July 5, 2007
    Inventors: Jonathan Brick, Jim Stevenson, John Andrews, Richard Schmachtenberg, Dan Massopust, Sharon Berger, Terrance Stephens, Chad Stenes
  • Publication number: 20070153069
    Abstract: A print head has an array of jets formed in a jet stack to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the jet stack. Control circuitry is arranged on the jet stack with an actuator array arranged on the control circuitry to cause the reservoir to deliver ink in response to signals from the control circuitry. A ground plane is arranged between the actuators and the ink reservoir. A print head has an array of jets formed into a jet stack to deliver ink to a printing medium and an actuator array formed on the jet stack, each actuator separated from other actuators by gaps. A spacer is arranged on the jet stack so as to fill the gaps between the actuators.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: James Stevenson, John Andrews, Bradley Gerner, Chad Slenes, Jonathan Brick
  • Publication number: 20070131451
    Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.
    Type: Application
    Filed: December 9, 2005
    Publication date: June 14, 2007
    Inventors: Richard Schmachtenberg, John Andrews, Bradley Gerner, Jonathan Brick, Samuel Schultz, Chad Slenes
  • Publication number: 20070132812
    Abstract: A printing system includes a print head to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the print head. Driving circuitry provides signals to the print head to control delivery of the ink and a flexible circuit interposed between the print head and the ink reservoirs connects the driving circuitry to the print head. The flexible circuit may include a heater to provide heat to the ink reservoirs. Alternatively, the flexible circuit may be replaced with a rigid substrate having a heater within its layers.
    Type: Application
    Filed: December 14, 2005
    Publication date: June 14, 2007
    Inventors: Dan Massopust, Curtis Keller, Steven Slotto, Peter Nystrom, John Andrews, Steven Korol, Scott Treece, Britton Pinson, Chad Slenes, Samuel Schultz, Lee Olen, Jonathan Brick
  • Publication number: 20050098270
    Abstract: Two circuit bearing substrates, such as a rigid electronic circuit board and a flexible circuit film, each having large arrays or multiple arrays of surface contact pads or traces, are mechanically and electrically joined without relocating the substrates during the bonding process by using a bonding apparatus with multiple working tools or bond shoes. The bonding apparatus includes a fixture for holding the circuit bearing substrates with a joining layer between them, and two or more independently operated heated bond shoes that compress different portions of the circuit bearing substrates with the joining layer, such as a layer of anisotropic conductive film.
    Type: Application
    Filed: December 9, 2004
    Publication date: May 12, 2005
    Inventors: Bhalchandra Karandikar, Jonathan Brick, Richard Schmachtenberg