Patents by Inventor Jonathan Bruce

Jonathan Bruce has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7358830
    Abstract: A segmented stub has at least one serpentine signal path that increases the effective electrical length of the stub without increasing the overall physical length or area of the stub. This permits more compact monolithic millimeter-wave and microwave integrated circuit design.
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: April 15, 2008
    Assignee: Rockwell Scientific Licensing, LLC
    Inventor: Jonathan Bruce Hacker
  • Patent number: 6919862
    Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface, with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: July 19, 2005
    Assignee: Rockwell Scientific Licensing, LLC
    Inventors: Jonathan Bruce Hacker, Moonil Kim, John A. Higgins
  • Publication number: 20050097914
    Abstract: This heating cooling machine will use less power and will help stop heating fires and will be smaller compared to other heating/cooling machines.
    Type: Application
    Filed: November 10, 2003
    Publication date: May 12, 2005
    Inventor: Jonathan Bruce
  • Publication number: 20050100505
    Abstract: This invention will make life easier in the energy business. Plenty of clean heat or coolant. Heat it up past coolant level (since compression cools it) and it should be hot air at the end.
    Type: Application
    Filed: May 21, 2003
    Publication date: May 12, 2005
    Inventor: Jonathan Bruce
  • Publication number: 20040066340
    Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface, with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.
    Type: Application
    Filed: September 26, 2003
    Publication date: April 8, 2004
    Applicant: Rockwell Technologies, LLC
    Inventors: Jonathan Bruce Hacker, Moonil Kim, John A. Higgins
  • Patent number: 6628242
    Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: September 30, 2003
    Assignee: Innovative Technology Licensing, LLC
    Inventors: Jonathan Bruce Hacker, Moonil Kim, John A. Higgins
  • Patent number: 6603357
    Abstract: An improved waveguide wall structure and improved waveguide using the new wall structure as the interior walls of the waveguide. The wall structure comprises a sheet of dielectric material, a series of parallel conductive strips on one side of the dielectric material and a layer of conductive material on the other side. Multiple conductive vias are also included through the dielectric material and between the conductive layer and conductive strips. The new wall structure presents as a series of parallel L-C circuits to a transverse E field at resonant frequency, resulting in a high impedance surface. The wall structure can be used in waveguides that transmit a signal in one polarization or signals that are cross polarized. The new waveguide maintains a near uniform density E field and H field component, resulting in near uniform signal power density across the waveguide cross section.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: August 5, 2003
    Assignee: Innovative Technology Licensing, LLC
    Inventors: John A. Higgins, Moonil Kim, Jonathan Bruce Hacker