Patents by Inventor Jonathan Byars

Jonathan Byars has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device support for bonding
    Patent number: 8720767
    Abstract: In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: May 13, 2014
    Assignee: Orthodyne Electronics Corporation
    Inventors: Jonathan Byars, Theodore J. Copperthite
  • SEMICONDUCTOR DEVICE SUPPORT FOR BONDING
    Publication number: 20110212572
    Abstract: In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.
    Type: Application
    Filed: November 19, 2009
    Publication date: September 1, 2011
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventors: Jonathan Byars, Theodore J. Copperthite