Abstract: A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. Each board is x-rayed to determine location coordinates information of the inner layers of multi layer circuit board panels. An optimization process determines optimal locations for drilling. The board is then drilled according to the optimized coordinates. By minimizing misregistration between the drilled holes and inner layers of the multi layer semiconductor circuit board, the present invention reduces a significant cause of scrap to the circuit board industry as well as removing a major impediment to further increasing circuit density and wireability.