Abstract: Method of manufacturing a single-side-contacted photovoltaic device (1), comprising the steps of: a) providing a photovoltaically-active substrate (3) defining a plurality of alternating hole collecting zones (3a) and electron collecting zones (3b) arranged in parallel strips; b) depositing a conductive layer (5) across said zones; c) depositing at least one conductive track (9) extending along at least part of each of said zones (3a, 3b); d) selectively forming a dielectric layer (7) on each of said zones (3a, 3b), so as to leave an exposed area free of dielectric at an interface between adjacent zones (3a, 3b); e) etching said conductive layer (5) in said exposed areas; f) applying a plurality of interconnecting conductors (11a, 11b) so as to electrically interconnect at least a portion of said hole collecting zones (3a) with each other, and to electrically interconnect at least a portion of said electron collecting zones (3b) with each other.

Abstract: Method of manufacturing a single-side-contacted photovoltaic device (1), comprising the steps of: a) providing a photovoltaically-active substrate (3) defining a plurality of alternating hole collecting zones (3a) and electron collecting zones (3b) arranged in parallel strips; b) depositing a conductive layer (5) across said zones; c) depositing at least one conductive track (9) extending along at least part of each of said zones (3a, 3b); d) selectively forming a dielectric layer (7) on each of said zones (3a, 3b), so as to leave an exposed area free of dielectric at an interface between adjacent zones (3a, 3b); e) etching said conductive layer (5) in said exposed areas; f) applying a plurality of interconnecting conductors (11a, 11b) so as to electrically interconnect at least a portion of said hole collecting zones (3a) with each other, and to electrically interconnect at least a portion of said electron collecting zones (3b) with each other.

Abstract: The invention relates to a method comprising a step of emitting at least one first gas flow (12), a step of sweeping the free surface of the material (15) by means of said first flow (12), followed by a step of discharging the first flow via at least one discharge area. Along with the step of emitting the first flow (12), a step of emitting at least one second gas flow (13) is implemented, said second gas flow forming a protective cover over the free surface of the material (15), at a distance from said free surface. The second gas flow (13) is discharged via an upper part of the discharge area of the container (10), while the first flow (12) is discharged through a lower part of the discharge area.

Abstract: The invention relates to a method comprising a step of emitting at least one first gas flow (12), a step of sweeping the free surface of the material (15) by means of said first flow (12), followed by a step of discharging the first flow via at least one discharge area. Along with the step of emitting the first flow (12), a step of emitting at least one second gas flow (13) is implemented, said second gas flow forming a protective cover over the free surface of the material (15), at a distance from said free surface. The second gas flow (13) is discharged via an upper part of the discharge area of the container (10), while the first flow (12) is discharged through a lower part of the discharge area.