Abstract: Various systems are provided for an electrical feedthrough circuit board for a high voltage tank, comprising a pair of outer signal layers, at least one inner signal layer; wherein the at least one inner signal layer electrically connects an air side of the electrical feedthrough circuit board and an oil side of the electrical feedthrough circuit board. As an example, the high voltage tank may comprise a high voltage tank tubular envelope, a printed circuit board having an oil side and an air side arranged inside the high voltage tank, a pair of O-rings arranged on either side of the printed circuit board, wherein the pair of O-rings surround the oil side of the printed circuit board, and an end plate.

Abstract: Various systems are provided for an electrical feedthrough circuit board for a high voltage tank, comprising a pair of outer signal layers, at least one inner signal layer; wherein the at least one inner signal layer electrically connects an air side of the electrical feedthrough circuit board and an oil side of the electrical feedthrough circuit board. As an example, the high voltage tank may comprise a high voltage tank tubular envelope, a printed circuit board having an oil side and an air side arranged inside the high voltage tank, a pair of O-rings arranged on either side of the printed circuit board, wherein the pair of O-rings surround the oil side of the printed circuit board, and an end plate.

Abstract: Systems and methods for a power electronics assembly. The power electronics assembly includes, in one example, a gate board electronically connected to a power board, a plurality of power modules which each include multiple power terminals which are electronically connected to the power board via multiple attachment devices, and multiple interconnection boards. In the power electronics assembly, each of the plurality of interconnection boards are electronically connected to the gate board via multiple gate board terminals and one of the power modules via multiple control terminals.