Patents by Inventor Jonathan D. PRANGE

Jonathan D. PRANGE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of enhancing copper electroplating
    Patent number: 11686006
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: June 27, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Method of enhancing copper electroplating
    Patent number: 11512406
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: November 29, 2022
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • METHOD OF ENHANCING COPPER ELECTROPLATING
    Publication number: 20220228282
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 21, 2022
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • PHOTORESIST RESOLUTION CAPABILITIES BY COPPER ELECTROPLATING ANISOTROPICALLY
    Publication number: 20220213610
    Abstract: Features of substrates are copper electroplated by a method which involves copper electroplating selectively deposited seed layers or seed layers of photoresist defined features with a copper electroplating composition containing select suppressor compounds and select leveler compounds which enable anisotropic plating. Optionally, the seed layers can be treated with an aqueous solution of sulfur containing accelerators prior to copper electroplating.
    Type: Application
    Filed: December 29, 2021
    Publication date: July 7, 2022
    Inventors: Alejo M. Lifschitz Arribio, Alexander Zielinski, Samer Hammoodi, Joseph F. Lachowski, Michael K. Gallagher, Curtis Williamson, Jonathan D. Prange
  • METHOD OF ENHANCING COPPER ELECTROPLATING
    Publication number: 20210115581
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Application
    Filed: September 21, 2020
    Publication date: April 22, 2021
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • PLATING BATH AND METHOD
    Publication number: 20150122662
    Abstract: Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 7, 2015
    Inventors: Julia WOERTINK, Yi QIN, Jonathan D. PRANGE, Pedro O. LOPEZ MONTESINOS
  • PLATING BATH AND METHOD
    Publication number: 20150122661
    Abstract: Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 7, 2015
    Inventors: Julia WOERTINK, Yi QIN, Jonathan D. PRANGE, Pedro O. LOPEZ MONTESINOS