Patents by Inventor Jonathan Douglas Hatch
Jonathan Douglas Hatch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240015886Abstract: A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Inventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Patent number: 11812553Abstract: A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer.Type: GrantFiled: April 28, 2022Date of Patent: November 7, 2023Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Publication number: 20230298812Abstract: Systems and methods for forming a magnetically-enabled part via additive manufacturing. The method includes depositing a layer of additive manufacturing material on a build plate, melting or sintering the layer of additive manufacturing material, depositing additional layers of additive manufacturing material on previous layers of additive manufacturing material, the additive manufacturing material of at least some of the additional layers being magnetically permeable, and melting or sintering the additional layers of additive manufacturing material such that the magnetically-enabled part has a transition region including at least some of the magnetically permeable additive manufacturing material.Type: ApplicationFiled: May 11, 2023Publication date: September 21, 2023Inventors: Jonathan Douglas Hatch, Bob Dearth, Ida Sanchez, Francisco Garcia-Moreno
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Patent number: 11688550Abstract: Systems and methods for forming a magnetically-enabled part via additive manufacturing. The method includes depositing a layer of additive manufacturing material on a build plate, melting or sintering the layer of additive manufacturing material, depositing additional layers of additive manufacturing material on previous layers of additive manufacturing material, the additive manufacturing material of at least some of the additional layers being magnetically permeable, and melting or sintering the additional layers of additive manufacturing material such that the magnetically-enabled part has a transition region including at least some of the magnetically permeable additive manufacturing material.Type: GrantFiled: October 20, 2020Date of Patent: June 27, 2023Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Jonathan Douglas Hatch, Bob Dearth, Ida Sanchez, Francisco Garcia-Moreno
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Publication number: 20230072115Abstract: A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.Type: ApplicationFiled: September 1, 2022Publication date: March 9, 2023Applicant: Honeywell Federal Manufacturing & Technologies, LLCInventors: Jonathan Douglas Hatch, Stephen McGarry Hatch
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Patent number: 11439023Abstract: A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.Type: GrantFiled: March 12, 2020Date of Patent: September 6, 2022Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Jonathan Douglas Hatch, Stephen McGarry Hatch
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Publication number: 20220279653Abstract: A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer.Type: ApplicationFiled: April 28, 2022Publication date: September 1, 2022Applicant: Honeywell Federal Manufacturing & Technologies, LLCInventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Patent number: 11350524Abstract: A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer.Type: GrantFiled: October 12, 2020Date of Patent: May 31, 2022Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Patent number: 11197401Abstract: A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.Type: GrantFiled: January 22, 2019Date of Patent: December 7, 2021Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Jonathan Douglas Hatch, Stephen McGarry Hatch
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Publication number: 20210289633Abstract: A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.Type: ApplicationFiled: March 12, 2020Publication date: September 16, 2021Applicant: Honeywell Federal Manufacturing & Technologies, LLCInventors: Jonathan Douglas Hatch, Stephen McGarry Hatch
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Publication number: 20210114097Abstract: Systems and methods for forming a magnetically-enabled part via additive manufacturing. The method includes depositing a layer of additive manufacturing material on a build plate, melting or sintering the layer of additive manufacturing material, depositing additional layers of additive manufacturing material on previous layers of additive manufacturing material, the additive manufacturing material of at least some of the additional layers being magnetically permeable, and melting or sintering the additional layers of additive manufacturing material such that the magnetically-enabled part has a transition region including at least some of the magnetically permeable additive manufacturing material.Type: ApplicationFiled: October 20, 2020Publication date: April 22, 2021Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLCInventors: Jonathan Douglas Hatch, Bob Dearth, Ida Sanchez, Francisco Garcia-Moreno
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Publication number: 20210092839Abstract: A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer.Type: ApplicationFiled: October 12, 2020Publication date: March 25, 2021Applicant: Honeywell Federal Manufacturing & Technologies, LLCInventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Publication number: 20200367358Abstract: A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer.Type: ApplicationFiled: May 13, 2019Publication date: November 19, 2020Applicant: Honeywell Federal Manufacturing & Technologies, LLCInventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Patent number: 10743419Abstract: A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.Type: GrantFiled: December 27, 2019Date of Patent: August 11, 2020Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Publication number: 20200236827Abstract: A system and method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multilayer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.Type: ApplicationFiled: January 22, 2019Publication date: July 23, 2020Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLCInventors: Jonathan Douglas Hatch, Stephen McGarry Hatch
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Publication number: 20200236788Abstract: A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.Type: ApplicationFiled: December 27, 2019Publication date: July 23, 2020Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLCInventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Patent number: 10531568Abstract: A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.Type: GrantFiled: January 22, 2019Date of Patent: January 7, 2020Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Stephen McGarry Hatch, Jonathan Douglas Hatch
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Patent number: 9955571Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.Type: GrantFiled: September 11, 2017Date of Patent: April 24, 2018Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Jonathan Douglas Hatch, Stephen McGarry Hatch
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Publication number: 20170374741Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.Type: ApplicationFiled: September 11, 2017Publication date: December 28, 2017Applicant: Honeywell Federal Manufacturing & Technologies, LLCInventors: Jonathan Douglas Hatch, Stephen McGarry Hatch
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Patent number: 9795035Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.Type: GrantFiled: November 21, 2016Date of Patent: October 17, 2017Assignee: Honeywell Federal Manufacturing & Technologies, LLCInventors: Jonathan Douglas Hatch, Stephen McGarry Hatch