Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.

Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.

Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

Abstract: A superconducting flexible interconnecting cable connector for supercomputing systems is provided. The cable connector includes a base with a recessed area defined therein to receive superconducting flexible interconnecting cables and superconducting connecting chips to electrically connect the superconducting flexible interconnecting cables to each other. A cover is provided to cover the superconducting flexible interconnecting cables and the superconducting connecting chips when the cover is in a closed position. A compression device compresses the superconducting connecting chips together to secure the superconducting flexible interconnecting cables and the superconducting connecting chips inside the recessed area of the base when the cover is in the closed position.

Abstract: A support structure for a flexible interconnect of a superconducting system can include a support member that is formed of thermally conductive material. The support member can include a plurality of parallel slots. Each slot can extend from a first surface of a base of the support member to a second surface of the base. The first and second surfaces of the base can be positioned on parallel planes and each slot can be shaped to allow relative movement of a fastener that allows a respective connector assembly to be affixed to the support member. Moreover, the respective connector assembly can provide mechanical support for the flexible interconnect of the superconducting system and establish a heat path between the flexible interconnect and the support member. The support member can also include a wall extending transverse from the first surface of the base, the wall comprising a plurality of through-holes.

Abstract: A support structure for a flexible interconnect of a superconducting system can include a support member that is formed of thermally conductive material. The support member can include a plurality of parallel slots. Each slot can extend from a first surface of a base of the support member to a second surface of the base. The first and second surfaces of the base can be positioned on parallel planes and each slot can be shaped to allow relative movement of a fastener that allows a respective connector assembly to be affixed to the support member. Moreover, the respective connector assembly can provide mechanical support for the flexible interconnect of the superconducting system and establish a heat path between the flexible interconnect and the support member. The support member can also include a wall extending transverse from the first surface of the base, the wall comprising a plurality of through-holes.

Abstract: A superconducting flexible interconnecting cable connector for supercomputing systems is provided. The cable connector includes a base with a recessed area defined therein to receive superconducting flexible interconnecting cables and superconducting connecting chips to electrically connect the superconducting flexible interconnecting cables to each other. A cover is provided to cover the superconducting flexible interconnecting cables and the superconducting connecting chips when the cover is in a closed position. A compression device compresses the superconducting connecting chips together to secure the superconducting flexible interconnecting cables and the superconducting connecting chips inside the recessed area of the base when the cover is in the closed position.

Abstract: An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards, each including first and second subassemblies. Each of the subassemblies is surrounded in a longitudinal-lateral plane by a corresponding first or second perimeter frame. The first and second subassemblies have first and second operating temperatures, respectively. A first temperature tank is formed by first perimeter frames and substantially surrounds the first subassemblies. A second temperature tank is formed by second perimeter frames and substantially surrounds the second circuit card subassemblies. A first temperature cooling supply line selectively introduces the first cooling fluid into the first temperature tank for at least partially inducing the first operating temperature. A second temperature cooling supply line selectively introduces the second cooling fluid into the second temperature tank for at least partially inducing the second operating temperature.

Abstract: An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.