Abstract: A spring clip includes a continuous spring band forming an angular integral first spring finger for pressing an electronic device package against a flat surface of an apertured substrate. A first bend of less than 90.degree. forms a substantially linear intermediate first band portion extending at an acute angle from the spring finger and a second bend of about 180.degree. extends from the intermediate first band portion, these portions together forming an integral U-shaped member including at least one compressible barb for insertion into a substrate aperture to lock the chip in the substrate and to press a device package between the finger and the substrate. In one embodiment two spring fingers and two oppositely-facing barbs are provided on the U-shaped member so that two spaced packages can be clamped simultaneously on a substrate surface while utilizing a single aperture for the U-shaped member.