Abstract: An image capturing device comprises a first elongated body portion formed of a first material and a second elongated body portion coupled to a proximal end of the first body portion. The second body portion is formed of a second material having a greater heat conductivity than the first material. The device further comprises an imaging window coupled to a distal end of the first body portion, a first housing within the first body portion, an image sensor mounted to the first housing, and an image processor mounted to the first housing and coupled to receive electrical signals from the image sensor. The device further comprises a second housing within the first body portion. The second housing is coupled to the first housing and to the window such that heat generated by the image sensor and image processor is transmitted through the second housing to the window.

Abstract: An image capturing device comprises an elongated body, an imaging window coupled to a distal end of the elongated body, and a heat source within the elongated body. The heat source is configured to apply heat to the imaging window to remove condensation from or prevent condensation from forming on the imaging window.

Abstract: An apparatus comprises a first fastener part having a first set of mating features and a second fastener part having a second set of mating features. Coupling the first set of mating features with the second set of mating features, such that the first set of mating features contacts and at least partially overlaps the second set of mating features, forms a fastener having a channel with a hexagonal cross-section. The channel is configured to receive a plurality of fibers. Coupling the first fastener part to the second fastener part clamps the plurality of fibers in a hexagonal packing configuration.

Abstract: A surgical system comprises a network accessible database configured to store calibration data for an endoscopic image capture device. The surgical system also comprises an image processor configured to be communicatively coupled to the endoscopic image capture device to receive image data of a surgical site during a surgical or diagnostic procedure. The image processor is configured to retrieve the calibration data from the network accessible database via a network connection. The image processor is further configured to process the received images based on the retrieved calibration data. The surgical system further comprises a user control system coupled to the image processor and configured to receive the processed images from the image processor. The user control system comprising a display configured to display the processed images. The calibration data is periodically or dynamically updated on the database to account for changes in the surgical system or new calibration methodologies.

Abstract: An apparatus comprises a first fastener part having a first set of mating features and a second fastener part having a second set of mating features. Coupling the first set of mating features with the second set of mating features forms a fastener having a channel with a hexagonal cross-section. The channel is configured to receive a plurality of fibers and place the plurality of fibers in a hexagonal packing configuration.

Abstract: An image capturing device comprises an elongated body, an imaging window coupled to a distal end of the elongated body, and a heat source within the elongated body. The heat source is configured to apply heat to the imaging window to remove condensation from or prevent condensation from forming on the imaging window.

Abstract: A method and apparatus for coupling fiber bundles. A plurality of fibers are secured within a channel of a fastener system to place the plurality of fibers in a packing configuration within the channel. The fastener system and the plurality of fibers secured by the fastener system are cut through to create a first fiber bundle and a second fiber bundle. The first fiber bundle is coupled with the second fiber bundle.

Abstract: A method and apparatus for coupling fiber bundles. A plurality of fibers are secured within a channel of a fastener system to place the plurality of fibers in a packing configuration within the channel. The fastener system and the plurality of fibers secured by the fastener system are cut through to create a first fiber bundle and a second fiber bundle. The first fiber bundle is coupled with the second fiber bundle.

Abstract: Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.

Abstract: Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.

Abstract: The present invention is a system and method for laser-assisted singulation of light emitting electronic devices manufactured on a substrate, having a processing surface and a depth extending from the processing surface. It includes providing a laser processing system having a picosecond laser having controllable parameters; controlling the laser parameters to form light pulses from the picosecond laser, to form a modified region having a depth which spans about 50% of the depth and substantially including the processing surface of the substrate and having a width less than about 5% of the region depth; and, singulating the substrate by applying mechanical stress to the substrate thereby cleaving the substrate into said light emitting electronic devices having sidewalls formed at least partially in cooperation with the linear modified regions.

Abstract: A test fixture for use with a Dynamic Mechanical Analyzer (DMA) restrains a hollow cylindrical tube for purposes of performing either a tensile or transverse/bending load test. The fixture includes a clamp that is configured to restrain the tube without imparting a preload or changing a mechanical property of the tube.

Abstract: A test fixture for use with a Dynamic Mechanical Analyzer (DMA) restrains a hollow cylindrical tube for purposes of performing either a tensile or transverse/bending load test. The fixture includes a clamp that is configured to restrain the tube without imparting a preload or changing a mechanical property of the tube.

Abstract: A test fixture for use with a Dynamic Mechanical Analyzer (DMA) restrains a hollow cylindrical tube for purposes of performing either a tensile or transverse/bending load test. The fixture includes a clamp that is configured to restrain the tube without imparting a preload or changing a mechanical property of the tube.

Abstract: An integrated circuit arrangement comprising an integrated circuit package having a package board. An integrated circuit die is mounted to a surface of the package board. A spring frame is mounted to the package board surface at a pair of opposite frame bends. The spring frame has a central opening that receives the integrated circuit die. Sides of the spring frame away from the bends are raised from the package surface. A heat sink is mounted to the spring frame such that a bottom of the heat sink contacts an upper surface of the integrated circuit die as the heat sink pushes the sides of the spring frame toward the package surface.