Patents by Inventor Jonathan Harold Laurer

Jonathan Harold Laurer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive compositions, micro-fluid ejection devices and methods for attaching micro-fluid ejection heads
    Patent number: 8163819
    Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: April 24, 2012
    Assignee: Lexmark International, Inc.
    Inventors: David Christopher Graham, Gary Anthony Holt, Jr., Jonathan Harold Laurer, Johnny Dale Massie, II, Melissa Marie Waldeck, Sean Terrence Weaver, Rich Wells
  • Flexible encapsulant materials for micro-fluid ejection heads and methods relating thereto
    Patent number: 7819506
    Abstract: Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: October 26, 2010
    Assignee: Lexmark International, Inc.
    Inventors: David Christopher Graham, Eric Spencer Hall, Gary Anthony Holt, Jr., Richard Leo Hubert, II, Johnny Dale Massie, Sean Terrance Weaver, Jonathan Harold Laurer, Rich Wells
  • Adhesive Compositions, Micro-fluid Ejection Devices and Methods for Attaching Mirco-Fluid Ejection Heads
    Publication number: 20100210759
    Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
    Type: Application
    Filed: April 27, 2010
    Publication date: August 19, 2010
    Inventors: David Christopher Graham, Gary Anthony Holt, JR., Jonathan Harold Laurer, Johnny Dale Massie, II, Melissa Marie Waldeck, Sean Terrence Weaver, Rich Wells
  • Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component
    Publication number: 20070232055
    Abstract: Methods and apparatuses for applying a protective material to an interconnect associated with a component. One such method involves placing a stencil in close proximity to an interconnect that extends over a cavity. An amount of protective material is placed on the stencil. A wiper is passed across the stencil. The wiper has an angle of attack of less than 50 degrees. At least a desired thickness of protective material is applied to the interconnect.
    Type: Application
    Filed: June 13, 2006
    Publication date: October 4, 2007
    Inventors: Richard Earl Corley, Shelby Wayne Dennis, Edgar Colin Diaz, Richard Leo Hubert, Jonathan Harold Laurer, Tu Phan, George Allan Ping, Jeanne Marie Saldanha Singh, Mary Claire Smoot, Paul Timothy Spivey
  • Flexible Encapsulant Materials For Micro-Fluid Ejection Heads And Methods Relating Thereto
    Publication number: 20070229575
    Abstract: Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
    Type: Application
    Filed: March 13, 2007
    Publication date: October 4, 2007
    Applicant: Lexmark International, Inc.
    Inventors: David Christopher Graham, Eric Spencer Hall, Gary Anthony Holt, Richard Leo Hubert, Johnny Dale Massie, Sean Terrance Weaver, Jonathan Harold Laurer, Rich Wells