Abstract: A radio frequency (RF) generator system includes first and second RF power sources, each RF power source applying a respective RF signal and second RF signal to a load. The first RF signal is applied in accordance with the application of the second RF signal. The application of the first RF signal is synchronized to application of the second RF signal. The first RF signal may be amplitude modulated in synchronization with the second RF signal, and the amplitude modulation can include blanking of the first RF signal. A frequency offset may be applied to the first RF signal in synchronization with the second RF signal. A variable actuator associated with the first RF power source may be controlled in accordance with the second RF signal.

Abstract: An integrated circuit, comprising a transistor-based cell comprising a set of fin field effect transistors (Fin FETs) chained together in a first direction, wherein the set of Fin FETs include fins extending longitudinally along the first direction and equally-spaced apart in a second direction orthogonal to the first direction by a fin pitch, and a set of polysilicon gates extending longitudinally along the second direction and equally-spaced apart in the first direction by a poly pitch, wherein a first dimension of the transistor-based cell along the first direction is substantially a first integer multiplied by the poly pitch, and wherein a second dimension of the transistor-based cell along the second direction is substantially a second integer multiplied by the fin pitch. The integrated circuit may include other non-transistor-based cells (e.g., passive cells), such as thin-film resistor or capacitor cells, which are arranged in a two-dimensional array with the transistor-based cell.

Abstract: An integrated circuit, comprising a transistor-based cell comprising a set of fin field effect transistors (Fin FETs) chained together in a first direction, wherein the set of Fin FETs include fins extending longitudinally along the first direction and equally-spaced apart in a second direction orthogonal to the first direction by a fin pitch, and a set of polysilicon gates extending longitudinally along the second direction and equally-spaced apart in the first direction by a poly pitch, wherein a first dimension of the transistor-based cell along the first direction is substantially a first integer multiplied by the poly pitch, and wherein a second dimension of the transistor-based cell along the second direction is substantially a second integer multiplied by the fin pitch. The integrated circuit may include other non-transistor-based cells (e.g., passive cells), such as thin-film resistor or capacitor cells, which are arranged in a two-dimensional array with the transistor-based cell.

Abstract: An IC includes an array of cells and a first set of endcap cells. The array of cells includes a first set of Mx layer power interconnects coupled to a first voltage, a first set of Mx layer interconnects, a second set of Mx layer power interconnects coupled to a second voltage source, and a second set of Mx layer interconnects. The first set of endcap cells includes first and second sets of Mx+1 layer interconnects. The first set of Mx+1 layer interconnects is coupled to the first set of Mx layer power interconnects and to the second set of Mx layer interconnects to provide a first set of decoupling capacitors. The second set of Mx+1 layer interconnects is coupled to the second set of Mx layer power interconnects and to the first set of Mx layer interconnects to provide a second set of decoupling capacitors.