Patents by Inventor Jonathan James Read

Jonathan James Read has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder alloy
    Patent number: 9999945
    Abstract: A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al2O3, or a combination thereof.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: June 19, 2018
    Assignees: NIHON SUPERIOR CO., LTD., THE UNIVERSITY OF QUEENSLAND
    Inventors: Tetsuro Nishimura, Kazuhiro Nogita, Stuart David McDonald, Jonathan James Read, Tina Ventura
  • SOLDER ALLOY
    Publication number: 20140030140
    Abstract: A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al2O3, or a combination thereof.
    Type: Application
    Filed: April 6, 2012
    Publication date: January 30, 2014
    Applicants: THE UNIVERSITY OF QUEENSLAND, NIHON SUPERIOR CO., LTD.
    Inventors: Tetsuro Nishimura, Kazuhiro Nogita, Stuart David McDonald, Jonathan James Read, Tina Ventura