Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Waveguide structures are built into integrated circuit devices using standard processing steps for semiconductor device fabrication. A waveguide may include a base, a top, and two side walls. At least one of the walls (e.g., the base or the top) may be formed in a metal layer. The base or top may be patterned to provide a transition to a planar transmission line, such as a coplanar waveguide. The side walls may be formed using vias.

Abstract: Described herein are integrated circuit devices that include conductive structures formed by direct bonding of different components, e.g., direct bonding of two dies, or of a die to a wafer. The conductive structures are formed from a top metallization layer of each of the components. For example, elongated conductive structures at the top metallization layer may be patterned and bonded to form large interconnects for high-frequency and/or high-power signals. In another example, the bonded conductive structures may form radio frequency passive devices, such as inductors or transformers.

Abstract: Methods and apparatus are disclosed for implementing capacitors in semiconductor devices. An example semiconductor die includes a first dielectric material disposed between a first metal interconnect and a second metal interconnect; and a capacitor positioned within a via extending through the first dielectric material between the first and second metal interconnects, the capacitor including a second dielectric material disposed in the via between the first and second metal interconnects.

Abstract: Disclosed herein are electronic assemblies, integrated circuit (IC) packages, and communication devices implementing three-dimensional power combiners. An electronic assembly may include a first die, comprising a first transmission line, and a second die, comprising a second transmission line. Each die includes a first face and an opposing second face, and the second die is stacked above the first die so that the first face of the second die is coupled to the second face of the first die. The electronic assembly further includes a first conductive pathway between one end of the first transmission line and a first connection point at the first face of the first die, a second conductive pathway between one end of the second transmission line and a second connection point at the first face of the first die, and a third conductive pathway between the other ends of the first and second transmission lines.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Systems and methods for monitoring, detecting, measuring, altering, optimizing, and/or modifying electrical power delivered to a power consuming device. The power consuming device can be a light, speakers, fans, motors, any household electronic appliance, or other power consuming device. Also disclosed are light assemblies including a first plurality of strings of red LED lights, a second plurality of strings of green LED lights, and a third plurality of strings of blue LED lights (e.g., SMD LEDs). The light assembly also includes a driver configured to intermittently supply power from a power source to the red LED lights, green LED lights, and blue LED lights. The light assembly also includes a housing to house the light assembly, the driver, the power source, and a controller.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Apparatuses, systems, and methods are presented for energy storage. A plurality of input connectors are configured to receive input power from one or more power sources. A plurality of input power converters are coupled to the input connectors, and are configured to convert the input power to direct current (DC) power for storage. A controller is configured to control power flow through the input power converters on a per-converter basis so that separate converters are separately controlled. One or more output power converters are configured to convert stored DC power to output power for use by one or more loads. The controller is configured to control power flow through the one or more output power converters. One or more output connectors are configured to transfer the output power to the one or more loads.

Abstract: Techniques are described related to digital radio control, partitioning, and operation. The various techniques described herein enable high-frequency local oscillator signal generation and frequency multiplication using radio-frequency (RF) digital to analog converters (RFDACs). The use of these components and others described throughout this disclosure allow for the realization of various improvements. For example, digital, analog, and hybrid beamforming control are implemented and the newly-enabled digital radio architecture partitioning enables radio components to be pushed to the radio head, allowing for the omission of high frequency cables and/or connectors.

Abstract: Apparatuses, systems, and methods are presented for energy storage. A plurality of input connectors are configured to receive input power from one or more power sources. A plurality of input power converters are coupled to the input connectors, and are configured to convert the input power to direct current (DC) power for storage. A controller is configured to control power flow through the input power converters on a per-converter basis so that separate converters are separately controlled. One or more output power converters are configured to convert stored DC power to output power for use by one or more loads. The controller is configured to control power flow through the one or more output power converters. One or more output connectors are configured to transfer the output power to the one or more loads.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.

Abstract: An example security sensor includes a battery power supply, camera coupled to the battery power supply to receive power, activity sensor, processor, and microcontroller. The processor is placed in a sleep state and is wakeable to an awake state. The processor coupled to the battery power supply, and coupled to the camera to receive and process image data including images of an activity within a zone. The microcontroller is coupled to the battery power supply, coupled to the activity sensor to receive interrupts responsive to detection by the activity sensor of the activity within the zone proximate the security sensor, coupled to the processor to send and receive data, and, responsive to receiving a first interrupt from the activity sensor, place the processor in an awake state to signal the camera to capture a set of images and to receive and process the image data including the set of images.

Abstract: An example security sensor includes a battery power supply, camera coupled to the battery power supply to receive power, activity sensor, processor, and microcontroller. The processor is placed in a sleep state and is wakeable to an awake state. The processor coupled to the battery power supply, and coupled to the camera to receive and process image data including images of an activity within a zone. The microcontroller is coupled to the battery power supply, coupled to the activity sensor to receive interrupts responsive to detection by the activity sensor of the activity within the zone proximate the security sensor, coupled to the processor to send and receive data, and, responsive to receiving a first interrupt from the activity sensor, place the processor in an awake state to signal the camera to capture a set of images and to receive and process the image data including the set of images.

Abstract: In one example, an electrical circuit includes a first functional block with an electrical load to produce an external result, a second functional block with a voltage isolator; a third functional block with a current controller. The first, second, and third functional blocks are connected such that the external result of the electrical load is determined by the current controller acting through the voltage isolator. The voltage isolator may be configured to limit a maximum voltage across the current controller.

Abstract: In one example, an electrical circuit includes a first functional block with an electrical load to produce an external result, a second functional block with a voltage isolator; a third functional block with a current controller. The first, second, and third functional blocks are connected such that the external result of the electrical load is determined by the current controller acting through the voltage isolator. The voltage isolator may be configured to limit a maximum voltage across the current controller.

Abstract: By way of example, a low-power processing device is disclosed. The low-power processing device includes a battery power supply, a processor, and a micro-controller. The processor sleeps by reducing voltage to a non-transitory memory of the processor and storing system settings in a non-transitory memory of the microcontroller, which is coupled to the processor via a communications bus. The processor is further coupled to the battery power supply to receive power. The microcontroller is coupled to the processor via the communications bus to send and receive data. The microcontroller sends an interrupt (A) to the processor and the processor receives A and wakes up by polling the microprocessor for an event associated with A and loads the system settings via the communications bus from the non-transitory memory of the microcontroller into the non-transitory memory of the processor.