Abstract: Calling a response provider based on detection of an emergency situation includes: receiving sensor data describing at least one characteristic of physical surroundings of a computing device; receiving biometric data for a user of the computing device; selecting, in dependence upon the biometric data and the sensor data, a profile of trigger data from among a plurality of profiles of trigger data; determining that the sensor data and the biometric data satisfy a threshold criterion of the profile of trigger data for activating a response trigger; and in response to the determination, activating the response trigger, including automatically and without the user's intervention: establishing a connection to an emergency response provider; and providing information describing the user to the emergency response provider.

Abstract: Calling a response provider based on detection of an emergency situation includes: receiving sensor data describing at least one characteristic of physical surroundings of a computing device; receiving biometric data for a user of the computing device; selecting, in dependence upon the biometric data and the sensor data, a profile of trigger data from among a plurality of profiles of trigger data; determining that the sensor data and the biometric data satisfy a threshold criterion of the profile of trigger data for activating a response trigger; and in response to the determination, activating the response trigger, including automatically and without the user's intervention: establishing a connection to an emergency response provider; and providing information describing the user to the emergency response provider.

Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heatsink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.

Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heat-sink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.

Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heat-sink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses a against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.

Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heat-sink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses a against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.