Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: Introduced here are carrier assemblies that include a rigid tray having a deck area with a patterned surface of cavities for receiving semiconductor components. The cavities can be designed to accommodate semiconductor components of different form factors (e.g., having different shapes, sizes, etc.). Moreover, an adhesive film can be affixed to the deck area to ensure that the semiconductor components are securely held against the top surface of the rigid tray. In some instances the adhesive film substantially conforms to the deck area, while in other instances the adhesive film extends across the opening of each cavity located in the deck area. Semiconductor component(s) can be secured to the carrier assembly based on the adhesiveness provided by the adhesive film, mechanical force provided the cavities, electrostatic force provided by the cavities, or any combination thereof.