Abstract: A substrate carrier structure wherein the substrate may be a wafer and its use in nanoscale processes, such as deposition and/or growth processes. The carrier structure comprises grooves on its frontside and or backside.

Abstract: A plate joint for joining two plates together includes a first plate and a second plate, with each of the first plate and second plate having a first edge and an opposite and generally parallel second edge. The first plate and second plate are connected together in a generally orthogonal orientation relative to each other with a finger joint defined by a notch in each plate which interlock with each other. The first edge of the first plate and the first edge of the second plate each have a groove therein which axially align with each other in and end-to-end manner. A locking pin is press fitted into the grooves in each of the first plate and the second plate.

Abstract: A plate joint for joining two plates together includes a first plate and a second plate, with each of the first plate and second plate having a first edge and an opposite and generally parallel second edge. The first plate and second plate are connected together in a generally orthogonal orientation relative to each other with a finger joint defined by a notch in each plate which interlock with each other. The first edge of the first plate and the first edge of the second plate each have a groove therein which axially align with each other in and end-to-end manner. A locking pin is press fitted into the grooves in each of the first plate and the second plate.

Abstract: A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.

Abstract: A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.