Abstract: A base having an air passageway there through, coupled to a stack having a pair of side walls and rear wall and a forward wall forming an air passageway. The stack is coupled to the base, and a dome being coupled to the stack. The dome has an air passageway there through. the dome having a plurality of hinge holes there through. The roof vent has a flap b which is rotatably coupled to the dome. The flap has a plurality of hinges which couple the flap to the dome.

Abstract: Implementations of the present disclosure relate to apparatuses, systems, and methods for determining when a well cleanup process has established developed flow and then extrapolating out modeled fluid parameter values to determine parameter values for a formation fluid. The model fluid parameter values may be modeled using a power law function having a specified exponent value.

Abstract: Implementations of the present disclosure relate to apparatuses, systems, and methods for determining when a well cleanup process has established developed flow and then extrapolating out modeled fluid parameter values to determine parameter values for a formation fluid. The model fluid parameter values may be modeled using a power law function having a specified exponent value.

Abstract: Methods and systems for knockdown and neutralization of toxic clouds of aerosolized chemical or biological warfare (CBW) agents and toxic industrial chemicals using a non-toxic, non-corrosive aqueous decontamination formulation.

Abstract: Methods and systems for knockdown and neutralization of toxic clouds of aerosolized chemical or biological warfare (CBW) agents and toxic industrial chemicals using a non-toxic, non-corrosive aqueous decontamination formulation.

Abstract: Embodiments relate to a substrate or wafer edge support having an emmisivity greater than that of a silicon wafer, where the edge support is for supporting a wafer during processing to form circuit devices on or in the wafer. Embodiments also include temperature sensors, heat conducting gas jets, and photonic energy can be directed to sense and control the temperature of the edge support and/or wafer edge during annealing to reduce temperature roll-off or roll-up at the edge as compared to the center of the wafer. Specifically, use of an edge support having an emmisivity greater than or equal to that of the wafer during processing allows helium gas jets directed at the edge support and/or wafer edge to reduce temperature roll-up at the edge during annealing. Because wafers from different processes and anneal locations may all have different emmisivities, use of the feedback loop will enable one edge ring to support the uniform anneal of wafers with a range of different emmisivities.

Abstract: Embodiments relate to a substrate or wafer edge support having an emmisivity greater than that of a silicon wafer, where the edge support is for supporting a wafer during processing to form circuit devices on or in the wafer. Embodiments also include temperature sensors, heat conducting gas jets, and photonic energy can be directed to sense and control the temperature of the edge support and/or wafer edge during annealing to reduce temperature roll-off or roll-up at the edge as compared to the center of the wafer. Specifically, use of an edge support having an emmisivity greater than or equal to that of the wafer during processing allows helium gas jets directed at the edge support and/or wafer edge to reduce temperature roll-up at the edge during annealing. Because wafers from different processes and anneal locations may all have different emmisivities, use of the feedback loop will enable one edge ring to support the uniform anneal of wafers with a range of different emmisivities.