Abstract: Systems, methods, and apparatus for dual condenser loop heat pipes for satellites with sun-normal radiators are disclosed. In one or more embodiments, a disclosed method for a satellite thermal management system comprises heating, in an evaporator, a liquid to convert the liquid to a vapor. The method further comprises passively circulating within tubing, from the evaporator, the vapor to a first radiator not illuminated by a sun and to a second radiator illuminated by the sun. Also, the method comprises converting the vapor to the liquid when the vapor is within the first radiator not illuminated by the sun. Further, the method comprises passively circulating within the tubing, from the first radiator not illuminated by the sun, the liquid to the evaporator.

Abstract: Systems, methods, and apparatus for dual condenser loop heat pipes for satellites with sun-normal radiators are disclosed. In one or more embodiments, a disclosed method for a satellite thermal management system comprises heating, in an evaporator, a liquid to convert the liquid to a vapor. The method further comprises passively circulating within tubing, from the evaporator, the vapor to a first radiator not illuminated by a sun and to a second radiator illuminated by the sun. Also, the method comprises converting the vapor to the liquid when the vapor is within the first radiator not illuminated by the sun. Further, the method comprises passively circulating within the tubing, from the first radiator not illuminated by the sun, the liquid to the evaporator.

Abstract: A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.

Abstract: A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.

Abstract: In one aspect a satellite comprises a body, a solid state power amplifier, a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device to reject heat acquired from the solid state power amplifier. Other aspects may be described.