Abstract: A circuit assembly comprising a sealed interface is configured to isolate one or more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.

Abstract: A circuit assembly comprising a sealed interface is configured to isolate one of more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.

Abstract: This invention relates to a rotary apparatus and related methods for pressing or cutting articles. More specifically, this invention relates to a rotary pressing assembly configured to reduce the stress upon the pressing member when performing a pressing operation on articles which have a variation in surface area, density or thickness. Even more specifically, this invention relates to a rotary knife assembly configured to reduce the stress upon the knife blade while cutting a plurality of articles from a sheet or web of material.