Abstract: Methods of image breathing correction. Implementations may include capturing and displaying a first image to a user using a lens, an image sensor, memory, and a display included in a camera unit, adjusting a position of the lens, capturing a second image and storing data of the second image collected by the image sensor in the memory. The method may include determining a second position of the lens using a lens position sensor included in the camera unit and calculating a change in magnification from the first image to the second image using a processor and a breathing correction model. The method may include rescaling the data of the second image to generate corrected second image data using the processor and displaying the corrected second image to a user. The corrected second image may be substantially free from breathing effects when compared with the first image.

Abstract: Methods of image breathing correction. Implementations may include capturing and displaying a first image to a user using a lens, an image sensor, memory, and a display included in a camera unit, adjusting a position of the lens, capturing a second image and storing data of the second image collected by the image sensor in the memory. The method may include determining a second position of the lens using a lens position sensor included in the camera unit and calculating a change in magnification from the first image to the second image using a processor and a breathing correction model. The method may include rescaling the data of the second image to generate corrected second image data using the processor and displaying the corrected second image to a user. The corrected second image may be substantially free from breathing effects when compared with the first image.

Abstract: A method for forming curved image sensors may include applying positive pressure to the face of an image sensor, forcing the image sensor to adhere the curved surface of a substrate. The pressure may be applied to the face of the image sensor in a variety of ways, including using pneumatic pressure, hydraulic pressure, or pressure from an elastic or inelastic solid. Processing may occur on either a single image sensor die or an image sensor wafer. When an image sensor wafer is processed, a substrate may be used that has a number of cavities defined by respective curved surfaces with each cavity corresponding to a respective image sensor. When pressure is applied to the image sensor, the image sensor may deform until the curvature of the image sensor matches the curvature of the curved surface of the underlying substrate.

Abstract: Methods of image breathing correction. Implementations may include capturing and displaying a first image to a user using a lens, an image sensor, memory, and a display included in a camera unit, adjusting a position of the lens, capturing a second image and storing data of the second image collected by the image sensor in the memory. The method may include determining a second position of the lens using a lens position sensor included in the camera unit and calculating a change in magnification from the first image to the second image using a processor and a breathing correction model. The method may include rescaling the data of the second image to generate corrected second image data using the processor and displaying the corrected second image to a user. The corrected second image may be substantially free from breathing effects when compared with the first image.

Abstract: An image sensor die may include a pixel array formed in an image sensor substrate. The image sensor die may be mounted to a thin metal interconnect layer that has been deposited on a sacrificial carrier substrate. The thin metal interconnect layer may include one or more metal layers that are patterned to form metal traces that serve as contact pads, signal lines, and other interconnects in the interconnect layer. The image sensor die may be wire bonded, flip-chip mounted, or otherwise mechanically and electrically coupled to the metal interconnect layer. The sacrificial carrier substrate may be etched or otherwise removed to expose the metal interconnects on the metal interconnect layer. An array of solder balls may be formed on the exposed metal interconnects to form a ball grid array package, or the exposed contact pads may be plated to form a leadless chip carrier package.

Abstract: An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array of image sensor pixels. The array of image sensor pixels may include a corresponding array of color filter elements. The system may include circuitry configured to detect and mitigate flare artifacts in image data captured using the image sensor. Detecting the flare artifacts may include detecting color mismatches in the captured image data and performing edge-detection operations to determine whether the color mismatches are in an edge region of the image data. If the color mismatches are detected in an edge region, no flare-mitigation operations may be performed. If the color mismatches are in a flat region of the captured image, flare-mitigation operations may be performed.

Abstract: A method for forming curved image sensors may include applying positive pressure to the face of an image sensor, forcing the image sensor to adhere the curved surface of a substrate. The pressure may be applied to the face of the image sensor in a variety of ways, including using pneumatic pressure, hydraulic pressure, or pressure from an elastic or inelastic solid. Processing may occur on either a single image sensor die or an image sensor wafer. When an image sensor wafer is processed, a substrate may be used that has a number of cavities defined by respective curved surfaces with each cavity corresponding to a respective image sensor. When pressure is applied to the image sensor, the image sensor may deform until the curvature of the image sensor matches the curvature of the curved surface of the underlying substrate.

Abstract: An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array. The system may include processing circuitry configured to mitigate flare artifacts in image data captured using the array based on at least one image flare map. The image flare map may identify a portion of the captured image data on which to perform image flare mitigation operations. The processing circuitry may perform image flare mitigation operations such as pixel value desaturation on the identified portion of the captured image data without desaturating portions of the image data that do not include flare artifacts. The flare map may be generated using a calibration system that characterizes the location, intensity, and color of all possible image flare artifacts that may be generated by the imaging system during normal imaging operations.

Abstract: An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array. The system may include processing circuitry configured to mitigate flare artifacts in image data captured using the array based on at least one image flare map. The image flare map may identify a portion of the captured image data on which to perform image flare mitigation operations. The processing circuitry may perform image flare mitigation operations such as pixel value desaturation on the identified portion of the captured image data without desaturating portions of the image data that do not include flare artifacts. The flare map may be generated using a calibration system that characterizes the location, intensity, and color of all possible image flare artifacts that may be generated by the imaging system during normal imaging operations.

Abstract: An image sensor die may include a pixel array formed in an image sensor substrate. The image sensor die may be mounted to a thin metal interconnect layer that has been deposited on a sacrificial carrier substrate. The thin metal interconnect layer may include one or more metal layers that are patterned to form metal traces that serve as contact pads, signal lines, and other interconnects in the interconnect layer. The image sensor die may be wire bonded, flip-chip mounted, or otherwise mechanically and electrically coupled to the metal interconnect layer. The sacrificial carrier substrate may be etched or otherwise removed to expose the metal interconnects on the metal interconnect layer. An array of solder balls may be formed on the exposed metal interconnects to form a ball grid array package, or the exposed contact pads may be plated to form a leadless chip carrier package.

Abstract: Image sensors may include image pixels and phase detection pixels. Phase detection pixels may he used during active lens alignment operations to accurately align camera module optics to the image sensor during camera module assembly. During active alignment operations, phase detection pixels may gather phase information from a target that is viewed through the camera module optics. Control circuitry may process the phase information to determine a distance and direction of lens movement needed to bring the target into focus and thereby align the camera module optics to the image sensor. A computer-controlled positioner may be used to adjust a position of the camera module optics relative to the image sensor based on information from the phase detection pixels. Once the camera module optics are accurately aligned relative to the image sensor, structures in the camera module assembly may be permanently attached to lock the alignment in place.

Abstract: An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array of image sensor pixels. The array of image sensor pixels may include a corresponding array of color filter elements. The system may include circuitry configured to detect and mitigate flare artifacts in image data captured using the image sensor. Detecting the flare artifacts may include detecting color mismatches in the captured image data and performing edge-detection operations to determine whether the color mismatches are in an edge region of the image data. If the color mismatches are detected in an edge region, no flare-mitigation operations may be performed. If the color mismatches are in a flat region of the captured image, flare-mitigation operations may be performed.

Abstract: A neo-wafer made from integrated circuit die and methods for making a neo-wafer are disclosed. Recesses are formed on a substrate and a dielectric layer with conductive pads is created for the receiving of one or more die. Die are flip-chip bonded to the conductive pads and all voids under-filled. The neo-wafer is thinned to expose the dielectric and the conductive pads exposed, creating a neo-wafer.

Abstract: A neo-wafer made from integrated circuit die and methods for making a neo-wafer are disclosed. Recesses are formed on a substrate and a dielectric layer with conductive pads is created for the receiving of one or more die. Die are flip-chip bonded to the conductive pads and all voids under-filled. The neo-wafer is thinned to expose the dielectric and the conductive pads exposed, creating a neo-wafer.

Abstract: An electronic film cartridge includes a can section that defines an outer contour and is used to hold electronic components, and an imager assembly. The outer contour is configured so as to not completely depress at least one sensor mounted to the film compartment of a photographic camera into which the film cartridge is to be inserted. The electronic film cartridge is also configured to fit within different cameras with different dimensions between the film can area and the aperture.

Abstract: An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a standoff frame for mounting a transparent window. The package includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane. The window can be configured such that its front (outer) face becomes the image plane of the packaged image sensor.