Patents by Inventor Jonathan P. Ehly

Jonathan P. Ehly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetically enhanced plastic package for microelectronics and manufacturing process
    Publication number: 20030178718
    Abstract: An hermetically enhanced hybrid microelectronic package of injection moldable plastic and ceramic parts, wherein a gas barrier is formed onto surfaces of the plastic parts through metalization. Further, interface surfaces between the plastic parts and any metal or ceramic parts are further treated to accommodate hermetically stable low temperature bonding such as soldering at a temperature which does not exceed the temperature limits of the plastic.
    Type: Application
    Filed: November 5, 2002
    Publication date: September 25, 2003
    Inventors: Jonathan P. Ehly, Jack A. Rubin, Prem K. Sood, Frank J. Polese