Patents by Inventor Jonathan P. Wigham

Jonathan P. Wigham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two part-cyanoacrylate/free radically curable adjesive systems
    Patent number: 9371470
    Abstract: Two part cyanoacrylate/free radical curable adhesive systems, are provided.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: June 21, 2016
    Assignee: Henkel IP & Holding GmbH
    Inventors: Rory B. Barnes, Barry N. Burns, Jonathan P. Wigham, Rachel M. Hersee, Emer Ward
  • TWO PART-CYANOACRYLATE/FREE RADICALLY CURABLE ADJESIVE SYSTEMS
    Publication number: 20140329959
    Abstract: Two part cyanoacrylate/free radical curable adhesive systems, are provided.
    Type: Application
    Filed: July 17, 2014
    Publication date: November 6, 2014
    Applicant: HENKEL IP & HOLDING GmbH
    Inventors: Rory B. Barnes, Barry N. Burns, Jonathan P. Wigham, Rachel M. Hersee, Emer Ward
  • Epoxy compositions having improved impact resistance
    Patent number: 7919555
    Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: April 5, 2011
    Assignees: Henkel AG & Co. KGaA, Loctite (R&D) Limited
    Inventors: Rajat Agarwal, Olaf Lammerschop, Rainer Schoenfeld, Hubert K. Schenkel, Barry N. Burns, Matthew J. Holloway, Mary B. Ward, Martin J. Fitzpatrick, Jonathan P. Wigham
  • Adducts and curable compositions using same
    Patent number: 7847034
    Abstract: The present invention relates to adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to inventive toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: December 7, 2010
    Assignee: Loctite (R&D) Limited
    Inventors: Barry N. Burns, Ray P. Tully, Jonathan P. Wigham
  • NOVEL ADDUCTS AND CURABLE COMPOSITIONS USING SAME
    Publication number: 20100234516
    Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.
    Type: Application
    Filed: May 21, 2010
    Publication date: September 16, 2010
    Applicants: Loctite (R&D) Limited, Henkel AG & Co, KGaA
    Inventors: Barry N. Burns, Ray P. Tully, Jonathan P. Wigham, Martin J. Fitzpatrick, Rainer Schoenfeld, Ciaran B. McArdle, Mark Loane
  • Adducts and curable compositions using same
    Patent number: 7759435
    Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having improved fracture toughness using those toughening adducts.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: July 20, 2010
    Assignees: Loctite (R&D) Limited, Henkel AG & Co. KGaA
    Inventors: Barry N. Burns, Ray P. Tully, Jonathan P. Wigham, Martin J. Fitzpatrick, Rainer Schoenfeld, Ciaran B. McArdle, Mark Loane
  • Adducts and curable compositions using same
    Patent number: 7750094
    Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: July 6, 2010
    Assignees: Loctite (R&D) Limited, Henkel AG & Co., KGaA
    Inventors: Barry N. Burns, Ray P. Tully, Jonathan P. Wigham, Martin J. Fitzpatrick, Rainer Schoenfeld, Ciaran B. McArdle, Mark Loane
  • Adducts and Curable Compositions Using Same
    Publication number: 20090240003
    Abstract: The present invention relates to adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to inventive toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.
    Type: Application
    Filed: March 20, 2008
    Publication date: September 24, 2009
    Applicant: Loctite (R&D) Limited
    Inventors: Barry N. Burns, Ray P. Tully, Jonathan P. Wigham
  • NOVEL ADDUCTS AND CURABLE COMPOSITIONS USING SAME
    Publication number: 20090234079
    Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.
    Type: Application
    Filed: March 24, 2009
    Publication date: September 17, 2009
    Applicants: Loctile (R&D) Limited, Henkel AG & Co. KGaA
    Inventors: Barry N. Burns, Ray P. Tully, Jonathan P. Wigham, Martin J. Fitzpatrick, Rainer Schoenfeld, Ciaran B. McArdle, Mark Loane
  • EPOXY COMPOSITIONS HAVING IMPROVED IMPACT RESISTANCE
    Publication number: 20080188609
    Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.
    Type: Application
    Filed: February 21, 2008
    Publication date: August 7, 2008
    Inventors: Rajat Agarwal, Olaf Lammerschop, Rainer Schoenfeld, Hubert K. Schenkel, Barry N. Burns, Matthew J. Holloway, Mary B. Ward, Martin J. Fitzpatrick, Jonathan P. Wigham
  • CURABLE COMPOSITIONS HAVING A REDUCED ENTHALPY OUTPUT
    Publication number: 20080177023
    Abstract: The present invention provides a curable composition selected from the group consisting of adhesives, sealants and coatings.
    Type: Application
    Filed: February 5, 2008
    Publication date: July 24, 2008
    Applicant: Loctite (R&D) Ltd.
    Inventors: Barry N. Burns, Jonathan P. Wigham
  • NOVEL ADDUCTS AND CURABLE COMPOSITIONS USING SAME
    Publication number: 20080076886
    Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having improved fracture toughness using those toughening adducts.
    Type: Application
    Filed: September 26, 2006
    Publication date: March 27, 2008
    Inventors: Barry N. Burns, Ray P. Tully, Jonathan P. Wigham, Martin J. Fitzpatrick, Rainer Schoenfeld, Ciaran B. McArdle, Mark Loane
  • Photocurable adhesive compositions, reaction products of which have low halide ion content
    Patent number: 6918984
    Abstract: The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: July 19, 2005
    Assignee: Loctite (R&D) Limited
    Inventors: Helen M. Murray, Jonathan P. Wigham, John E. Cahill, Aisling Lakes, Matthew J. Holloway, Eadaoin D. Ledwidge, Mary B. Ward
  • Photocurable adhesive compositions, reaction products of which have low halide ion content
    Publication number: 20040006150
    Abstract: The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.
    Type: Application
    Filed: June 24, 2002
    Publication date: January 8, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Helen M. Murray, Jonathan P. Wigham, John E. Cahill, Aisling Lakes, Matthew J. Holloway, Eadaoin D. Ledwidge, Mary B. Ward