Abstract: Printed circuit board assemblies having capabilities for operating under high ampacity conditions are sometimes difficult to fabricate and lack sufficient mechanical robustness for extreme operating environments. Accordingly, printed circuit board assemblies comprise: a non-conductive substrate having a plurality of planar conductive pathways disposed thereon; an electronic component that is in electrical communication with one or more of the planar conductive pathways and is configured to supply an electrical current thereto; a superficial metallic conductor overlaying one or more of the planar conductive pathways, at least in part, the superficial metallic conductor having an electrical connection to the electronic component and also being in electrical communication with the planar conductive pathways; and a conductive element in electrical communication with the superficial metallic conductor, the conductive element being configured to withdraw electrical current from the printed circuit board assembly.

Abstract: An example method of calibrating a downhole tool includes stimulating a known current through a power circuit provided in the downhole tool, the power circuit extending between and communicably coupling a power source and a load. A conductor magnetic field is generated as the known current flows through the power circuit and the conductor magnetic field is detectable by a magnetic sensor included in the downhole tool to obtain sample measurements of Earth's magnetic field. A magnitude of the conductor magnetic field is then measured to obtain a measured value for the conductor magnetic field, and a relationship between the known current and the measured value is determined to calculate a correction factor for the sample measurements based on the relationship. A computer in the downhole tool is then programmed to apply the correction factor to the sample measurements in response to operational currents measured in the power circuit during operation.

Abstract: A slip ring apparatus including a ring assembly having a conductive ring with a conductive ring engagement surface, a contact assembly having a contact element with a contact element engagement surface for engaging with the conductive ring engagement surface, and a surface discontinuity provided in at least one of the conductive ring engagement surface and the contact element engagement surface. An apparatus including the slip ring apparatus, wherein the apparatus includes a housing having an interior and a shaft rotatably extending through the interior of the housing. A method for reducing the potential of a hydroplaning effect in a slip ring apparatus, including providing a surface discontinuity in at least one of a conductive ring engagement surface and a contact element engagement surface.

Abstract: A method for determining a configuration of a mechanical actuator coupled to a drilling shaft in a drilling shaft deflection device of a rotary steerable subterranean drill. The method includes receiving, at a controller, data representative of a present rotary position of a rotor of an electronically commutated deflector motor of a drilling shaft deflection device of a rotary steerable subterranean drill. The rotor is operatively coupled by a fixed-ratio transmission to a mechanical actuator comprising a drilling shaft receiver coupled about a portion of a deflectable drilling shaft of the drilling shaft deflection device. The method includes determining, at the controller, the present position of the drilling shaft receiver in dependence upon the received data representative of the present rotary position of the rotor of the electronically commutated deflector motor.

Abstract: A slip ring apparatus including a ring assembly having a conductive ring with a conductive ring engagement surface, a contact assembly having a contact element with a contact element engagement surface for engaging with the conductive ring engagement surface, and a surface discontinuity provided in at least one of the conductive ring engagement surface and the contact element engagement surface. An apparatus including the slip ring apparatus, wherein the apparatus includes a housing having an interior and a shaft rotatably extending through the interior of the housing. A method for reducing the potential of a hydroplaning effect in a slip ring apparatus, including providing a surface discontinuity in at least one of a conductive ring engagement surface and a contact element engagement surface.

Abstract: A method for controlling an electrical actuator is disclosed. The method may include driving an electrical actuator at a power level during each of a plurality of actuation attempts and determining whether the electrical actuator actuated during each of the plurality of actuation attempts. The method may also include counting a number of failed actuation attempts, counting a number of successful actuation attempts. In addition, the method may include adjusting the power level based on at least one of the number of failed actuation attempts and the number of successful actuation attempts, and driving the electrical actuator at an adjusted power level.

Abstract: Printed circuit board assemblies having capabilities for operating under high ampacity conditions can sometimes be difficult to fabricate and may lack sufficient mechanical robustness for extreme operating environments.

Abstract: A slip ring apparatus including a ring assembly having a conductive ring with a conductive ring engagement surface, a contact assembly having a contact element with a contact element engagement surface for engaging with the conductive ring engagement surface, and a surface discontinuity provided in at least one of the conductive ring engagement surface and the contact element engagement surface. An apparatus including the slip ring apparatus, wherein the apparatus includes a housing having an interior and a shaft rotatably extending through the interior of the housing. A method for reducing the potential of a hydroplaning effect in a slip ring apparatus, including providing a surface discontinuity in at least one of a conductive ring engagement surface and a contact element engagement surface.