Abstract: A system includes a housing and a first circuit board positioned inside the housing. The housing has top, bottom, left side, right side, front, and rear panels. The first circuit board has a length, a width, and a thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

Abstract: A system includes a first chiplet, a second chiplet, an electronic amplification module, and a converter module. The first chiplet includes, e.g., a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, an application specific integrated circuit (ASIC), or a data storage device. The second chiplet includes a photonic module having, e.g., optical switches, optical couplers, optical routers, optical splitters, optical multiplexers, optical demultiplexers, optical filters, optical modulators, optical phase shifters, lasers, optical amplifiers, optical-to-electrical signal converters, or electrical-to-optical signal converters. The electronic amplification module includes, e.g., a driver amplifier or a transimpedance amplifier, and configured to process electrical signals sent to or from the photonic module.

Abstract: A system includes a housing and a first circuit board positioned inside the housing. The housing has top, bottom, left side, right side, front, and rear panels. The first circuit board has a length, a width, and a thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

Abstract: A method and system of equalizing in a decision feedback equalizer is provided. A plurality of adder circuits receives a digital code representing a previously decided symbol from an output of a prior path of a plurality of paths. A decision-making slicer circuit receives an input voltage and a first clock signal. The plurality of adder circuits receives a second clock signal and injects an offset current proportional to the digital code representing the previously decided symbol into a current injection input of the decision-making slicer circuit, at a first edge of the second clock signal. There is a predetermined skew between the first clock and the second clock to control a timing between the injection of the offset current of the plurality of adder circuits and the initiation of a decision-making phase of the decision-making slicer circuit.