Abstract: A printhead reservoir assembly has at least one reservoir to hold ink. The assembly includes an outlet plate having siphon vents to allow air to exit an ink path, a manifold plate having at least one manifold to channel ink and manifold outlets to corresponding to the siphon vents, a jet stack having an array of jets to transfer ink out of the printhead reservoir assembly to a printing substrate and jet stack outlets corresponding to the siphon vents, and a circuit board between the jet stack and the manifold plate to operate the jet stack, the circuit board having outlets corresponding to the siphon vents. A printhead reservoir has an ink input port, an ink reservoir to hold ink received through the ink input port, an ink channel to pipe ink to the jets, and an air vent at the top of the channels to vent the air bubbles from the jet ink path when pressure is applied. The air vents have channels separate from the jetting fluid path that exit the jet stack.

Abstract: Two circuit bearing substrates, such as a rigid electronic circuit board and a flexible circuit film, each having large arrays or multiple arrays of surface contact pads or traces, are mechanically and electrically joined without relocating the substrates during the bonding process by using a bonding apparatus with multiple working tools or bond shoes. The bonding apparatus includes a fixture for holding the circuit bearing substrates with a joining layer between them, and two or more independently operated heated bond shoes that compress different portions of the circuit bearing substrates with the joining layer, such as a layer of anisotropic conductive film.