Abstract: A semiconductor device that includes a semiconductor substrate having a surface, the surface having several regions having different thermal and/or mechanical requirements; and a composite thermal interface material including several spatially localized thermal interface materials placed on the surface, each of the several thermal interface materials tailored to the different thermal and/or mechanical requirements of each of the regions. Also disclosed is a method of forming the composite thermal interface material.

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

Abstract: Triggered sensor data capture in a mobile device environment. A method monitors primary sensor data obtained from first wearable sensor device(s) to determine whether trigger condition(s) are met for triggering supplemental sensor data capture. Based on recognizing a health event, the method obtains health status input from a user, configures second wearable sensor device(s) to obtain supplemental sensor data that includes additional data in addition to the primary sensor data, and obtains the supplemental sensor data. The method provides the health status input and the obtained supplemental sensor data as correlated health event data of the health event for analysis. Based on the analysis, the method tunes at least one trigger condition of the trigger condition(s) to adjust a scope of supplemental sensor data capture.

Abstract: Mechanical integrity sensors are provided to detect occurrence of an out-of-tolerance force on a component, such as a circuit board. The mechanical integrity sensor includes a light-blocking container and a light collector disposed within the light-blocking container. The light-blocking container includes a breakable panel. The breakable panel fractures with a force on the breakable panel indicative of the out-of-tolerance force on the component. Fracturing of the breakable panel allows light into the light-blocking container, and the light is collected by the light collector as indicative of the occurrence of the out-of-tolerance force on the component.

Abstract: A semiconductor device that includes a semiconductor substrate having a surface, the surface having several regions having different thermal and/or mechanical requirements; and a composite thermal interface material including several spatially localized thermal interface materials placed on the surface, each of the several thermal interface materials tailored to the different thermal and/or mechanical requirements of each of the regions. Also disclosed is a method of forming the composite thermal interface material.

Abstract: A method includes initiating a power on sequence of a computer equipment including a plurality of sensors at a serviceable location within a component of the computer equipment, the plurality of sensors communicating with a sensor monitor coupled with an interlock mechanism, and a service console capable of communicating with the sensor monitor, receiving feedback data from the plurality of sensors during the power on sequence, each of the plurality of sensors is detecting a physical condition at the serviceable location, determining whether the feedback data exceeds a predefined threshold value, the feedback data exceeding the predefined threshold value is associated with a fault at a serviceable location, in response to the feedback data exceeding the predefined threshold value, logging the fault at the serviceable location, aborting the power on sequence of the equipment, and prompting an equipment servicer of the fault at the serviceable location.

Abstract: An embodiment of the invention may include a method, computer program product and system for guided service procedure. The embodiment may include receiving feedback data from one or more of a plurality of sensors. Each of the plurality of sensors may detect a physical condition at a serviceable location within an item of equipment. The item of equipment may be undergoing a service procedure by an equipment servicer. The embodiment may include determining whether the received feedback data from one or more of the plurality of sensors exceeds a threshold value. Based on determining that the threshold value is exceeded, the embodiment may include alerting the equipment servicer during the service procedure.

Abstract: An electro-mechanical fuse is provided and includes a chassis component, an extrusion disposed on a monitored component which is disposable proximate to the chassis component and a sensor. The sensor is mounted to the chassis component. The sensor is mechanically breakable in power-on and power-off conditions by the extrusion as a result of a predefined action of or relative to the monitored component. The sensor electrically signals an occurrence of the mechanical breakage during power-on conditions following mechanical breakage.

Abstract: Mechanical integrity sensors are provided to detect occurrence of an out-of-tolerance force on a component, such as a circuit board. The mechanical integrity sensor includes a light-blocking container and a light collector disposed within the light-blocking container. The light-blocking container includes a breakable panel. The breakable panel fractures with a force on the breakable panel indicative of the out-of-tolerance force on the component. Fracturing of the breakable panel allows light into the light-blocking container, and the light is collected by the light collector as indicative of the occurrence of the out-of-tolerance force on the component.

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

Abstract: Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.

Abstract: An embodiment of the invention may include a method, computer program product and system for guided service procedure. The embodiment may include receiving feedback data from one or more of a plurality of sensors. Each of the plurality of sensors may detect a physical condition at a serviceable location within an item of equipment. The item of equipment may be undergoing a service procedure by an equipment servicer. The embodiment may include determining whether the received feedback data from one or more of the plurality of sensors exceeds a threshold value. Based on determining that the threshold value is exceeded, the embodiment may include alerting the equipment servicer during the service procedure.

Abstract: An electro-mechanical fuse is provided and includes a chassis component, an extrusion disposed on a monitored component which is disposable proximate to the chassis component and a sensor. The sensor is mounted to the chassis component. The sensor is mechanically breakable in power-on and power-off conditions by the extrusion as a result of a predefined action of or relative to the monitored component. The sensor electrically signals an occurrence of the mechanical breakage during power-on conditions following mechanical breakage.

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

Abstract: A method includes initiating a power on sequence of a computer equipment including a plurality of sensors at a serviceable location within a component of the computer equipment, the plurality of sensors communicating with a sensor monitor coupled with an interlock mechanism, and a service console capable of communicating with the sensor monitor, receiving feedback data from the plurality of sensors during the power on sequence, each of the plurality of sensors is detecting a physical condition at the serviceable location, determining whether the feedback data exceeds a predefined threshold value, the feedback data exceeding the predefined threshold value is associated with a fault at a serviceable location, in response to the feedback data exceeding the predefined threshold value, logging the fault at the serviceable location, aborting the power on sequence of the equipment, and prompting an equipment servicer of the fault at the serviceable location.

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

Abstract: An electro-mechanical fuse is provided and includes a chassis component, an extrusion disposed on a monitored component which is disposable proximate to the chassis component and a sensor. The sensor is mounted to the chassis component. The sensor is mechanically breakable in power-on and power-off conditions by the extrusion as a result of a predefined action of or relative to the monitored component. The sensor electrically signals an occurrence of the mechanical breakage during power-on conditions following mechanical breakage.