Patents by Inventor Jonathan S. Dahm

Jonathan S. Dahm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9726435
    Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: August 8, 2017
    Inventor: Jonathan S. Dahm
  • Patent number: 9632294
    Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: April 25, 2017
    Assignee: Heraeus Noblelight America LLC
    Inventor: Jonathan S. Dahm
  • Publication number: 20140319386
    Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.
    Type: Application
    Filed: July 9, 2014
    Publication date: October 30, 2014
    Inventor: Jonathan S. Dahm
  • Patent number: 8809820
    Abstract: A lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: August 19, 2014
    Assignee: Heraeus Noblelight Fusion UV Inc.
    Inventor: Jonathan S. Dahm
  • Patent number: 8723146
    Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: May 13, 2014
    Assignee: Heraeus Noblelight Fusion UV Inc.
    Inventors: Jonathan S. Dahm, Mark Jongewaard, Geoff Campbell
  • Patent number: 8685005
    Abstract: A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: April 1, 2014
    Assignee: Purdue Pharmaceutical Products L.P.
    Inventors: Jonathan S. Dahm, William Louis Barnard, James C. Chen, David B. Shine
  • Patent number: 8378322
    Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: February 19, 2013
    Assignee: Fusion UV Systems
    Inventors: Jonathan S. Dahm, Mark Jongewaard, Geoff Campbell
  • Publication number: 20130021789
    Abstract: A lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.
    Type: Application
    Filed: August 20, 2012
    Publication date: January 24, 2013
    Inventor: Jonathan S. Dahm
  • Patent number: 8047686
    Abstract: The present invention provides an optical device comprising one or more heat pipes with a desired level of thermal coupling with the light-emitting elements which are positioned along a periphery of the evaporator surface portion of the heat pipe in such a way that they are thermally coupled to the heat pipe. In one embodiment, the heat pipe of the present invention can be readily integrated with optical elements such as reflectors or collimators.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: November 1, 2011
    Inventors: Jonathan S. Dahm, Mark Paul Jongewaard
  • Publication number: 20110204261
    Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.
    Type: Application
    Filed: January 26, 2011
    Publication date: August 25, 2011
    Inventors: Jonathan S. Dahm, Mark Jongewaard, Geoff Campbell
  • Patent number: 7989839
    Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: August 2, 2011
    Assignee: Koninklijke Philips Electronics, N.V.
    Inventor: Jonathan S. Dahm
  • Patent number: 7863641
    Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: January 4, 2011
    Inventor: Jonathan S. Dahm
  • Publication number: 20100220472
    Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.
    Type: Application
    Filed: March 3, 2010
    Publication date: September 2, 2010
    Inventor: Jonathan S. Dahm
  • Publication number: 20100219736
    Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.
    Type: Application
    Filed: March 1, 2010
    Publication date: September 2, 2010
    Inventor: Jonathan S. Dahm
  • Publication number: 20100145415
    Abstract: A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.
    Type: Application
    Filed: October 11, 2007
    Publication date: June 10, 2010
    Inventors: Jonathan S. Dahm, William Louis Barnard, James C. Chen, David B. Shine
  • Publication number: 20080205062
    Abstract: The present invention provides an optical device comprising one or more heat pipes with a desired level of thermal coupling with the light-emitting elements which are positioned along a periphery of the evaporator surface portion of the heat pipe in such a way that they are thermally coupled to the heat pipe. In one embodiment, the heat pipe of the present invention can be readily integrated with optical elements such as reflectors or collimators.
    Type: Application
    Filed: August 31, 2007
    Publication date: August 28, 2008
    Inventors: Jonathan S. Dahm, Mark Paul Jongewaard
  • Patent number: 7345320
    Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: March 18, 2008
    Inventor: Jonathan S. Dahm
  • Patent number: 6330259
    Abstract: A laser device includes a laser rod; a radial array of diode laser pumping devices, wherein each diode laser has a solid connection to the laser rod to maximize laser energy transfer. The diode laser radial array is serially connected via coatings and/or fingers and/or spheres. Cooling of the laser rod and the diode laser radial array is accomplished via a common fluid channel outside the laser rod, wherein a cooling fluid flows past the laser rod and the diode laser radial array. Innovative methods for creating the coating embodiments are disclosed. Various flat diode laser embodiment are also disclosed.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: December 11, 2001
    Inventor: Jonathan S. Dahm
  • Patent number: 5870421
    Abstract: A laser system capable of high speed silicon wafer dicing is disclosed. A laser with high average power, high repetition rate, ultra-short pulsewidth, and excellent beam quality is described. This is achieved by the use of high power diodes used to uniformly pump an improved Nd:YAlO.sub.3 crystal, resulting in a beam with excellent quality. In addition, a beta-barium borate (BBO) crystal, used in conjunction with drift step recovery diodes (DSRDs), forms a high speed optical switch which can be used to cavity dump the laser.
    Type: Grant
    Filed: May 12, 1997
    Date of Patent: February 9, 1999
    Inventor: Jonathan S. Dahm
  • Patent number: RE46504
    Abstract: A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: August 8, 2017
    Assignee: PURDUE PHARMACEUTICAL PRODUCTS L.P.
    Inventors: Jonathan S. Dahm, William Louis Barnard, James C. Chen, David B. Shine