Patents by Inventor Jonathan S. Dahm
Jonathan S. Dahm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9726435Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.Type: GrantFiled: January 24, 2005Date of Patent: August 8, 2017Inventor: Jonathan S. Dahm
-
Patent number: 9632294Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.Type: GrantFiled: July 9, 2014Date of Patent: April 25, 2017Assignee: Heraeus Noblelight America LLCInventor: Jonathan S. Dahm
-
Publication number: 20140319386Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.Type: ApplicationFiled: July 9, 2014Publication date: October 30, 2014Inventor: Jonathan S. Dahm
-
Patent number: 8809820Abstract: A lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.Type: GrantFiled: August 20, 2012Date of Patent: August 19, 2014Assignee: Heraeus Noblelight Fusion UV Inc.Inventor: Jonathan S. Dahm
-
Patent number: 8723146Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.Type: GrantFiled: January 4, 2013Date of Patent: May 13, 2014Assignee: Heraeus Noblelight Fusion UV Inc.Inventors: Jonathan S. Dahm, Mark Jongewaard, Geoff Campbell
-
Patent number: 8685005Abstract: A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.Type: GrantFiled: October 11, 2007Date of Patent: April 1, 2014Assignee: Purdue Pharmaceutical Products L.P.Inventors: Jonathan S. Dahm, William Louis Barnard, James C. Chen, David B. Shine
-
Patent number: 8378322Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.Type: GrantFiled: January 26, 2011Date of Patent: February 19, 2013Assignee: Fusion UV SystemsInventors: Jonathan S. Dahm, Mark Jongewaard, Geoff Campbell
-
Publication number: 20130021789Abstract: A lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.Type: ApplicationFiled: August 20, 2012Publication date: January 24, 2013Inventor: Jonathan S. Dahm
-
Patent number: 8047686Abstract: The present invention provides an optical device comprising one or more heat pipes with a desired level of thermal coupling with the light-emitting elements which are positioned along a periphery of the evaporator surface portion of the heat pipe in such a way that they are thermally coupled to the heat pipe. In one embodiment, the heat pipe of the present invention can be readily integrated with optical elements such as reflectors or collimators.Type: GrantFiled: August 31, 2007Date of Patent: November 1, 2011Inventors: Jonathan S. Dahm, Mark Paul Jongewaard
-
Publication number: 20110204261Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.Type: ApplicationFiled: January 26, 2011Publication date: August 25, 2011Inventors: Jonathan S. Dahm, Mark Jongewaard, Geoff Campbell
-
Patent number: 7989839Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.Type: GrantFiled: March 1, 2010Date of Patent: August 2, 2011Assignee: Koninklijke Philips Electronics, N.V.Inventor: Jonathan S. Dahm
-
Patent number: 7863641Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.Type: GrantFiled: October 12, 2007Date of Patent: January 4, 2011Inventor: Jonathan S. Dahm
-
Publication number: 20100219736Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.Type: ApplicationFiled: March 1, 2010Publication date: September 2, 2010Inventor: Jonathan S. Dahm
-
Publication number: 20100220472Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.Type: ApplicationFiled: March 3, 2010Publication date: September 2, 2010Inventor: Jonathan S. Dahm
-
Publication number: 20100145415Abstract: A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.Type: ApplicationFiled: October 11, 2007Publication date: June 10, 2010Inventors: Jonathan S. Dahm, William Louis Barnard, James C. Chen, David B. Shine
-
Publication number: 20080205062Abstract: The present invention provides an optical device comprising one or more heat pipes with a desired level of thermal coupling with the light-emitting elements which are positioned along a periphery of the evaporator surface portion of the heat pipe in such a way that they are thermally coupled to the heat pipe. In one embodiment, the heat pipe of the present invention can be readily integrated with optical elements such as reflectors or collimators.Type: ApplicationFiled: August 31, 2007Publication date: August 28, 2008Inventors: Jonathan S. Dahm, Mark Paul Jongewaard
-
Patent number: 7345320Abstract: The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.Type: GrantFiled: November 2, 2004Date of Patent: March 18, 2008Inventor: Jonathan S. Dahm
-
Patent number: 6330259Abstract: A laser device includes a laser rod; a radial array of diode laser pumping devices, wherein each diode laser has a solid connection to the laser rod to maximize laser energy transfer. The diode laser radial array is serially connected via coatings and/or fingers and/or spheres. Cooling of the laser rod and the diode laser radial array is accomplished via a common fluid channel outside the laser rod, wherein a cooling fluid flows past the laser rod and the diode laser radial array. Innovative methods for creating the coating embodiments are disclosed. Various flat diode laser embodiment are also disclosed.Type: GrantFiled: May 8, 2000Date of Patent: December 11, 2001Inventor: Jonathan S. Dahm
-
Patent number: 5870421Abstract: A laser system capable of high speed silicon wafer dicing is disclosed. A laser with high average power, high repetition rate, ultra-short pulsewidth, and excellent beam quality is described. This is achieved by the use of high power diodes used to uniformly pump an improved Nd:YAlO.sub.3 crystal, resulting in a beam with excellent quality. In addition, a beta-barium borate (BBO) crystal, used in conjunction with drift step recovery diodes (DSRDs), forms a high speed optical switch which can be used to cavity dump the laser.Type: GrantFiled: May 12, 1997Date of Patent: February 9, 1999Inventor: Jonathan S. Dahm
-
Patent number: RE46504Abstract: A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.Type: GrantFiled: April 1, 2016Date of Patent: August 8, 2017Assignee: PURDUE PHARMACEUTICAL PRODUCTS L.P.Inventors: Jonathan S. Dahm, William Louis Barnard, James C. Chen, David B. Shine