Abstract: Laser processing systems and methods image a multiple core array to a work surface in a multiple processing beam array. An optical system separates processing beams and converges the beams toward the work surface and focuses each beam of the array at or near the work surface. A central axis with access for filler material flow to the work surface is provided. The processing beam array and central filler material feed provide omni-directional additive laser processing capability.

Abstract: Laser processing systems and methods image a multiple core array to a work surface in a multiple processing beam array. An optical system separates processing beams and converges the beams toward the work surface and focuses each beam of the array at or near the work surface. A central axis with access for filler material flow to the work surface is provided. The processing beam array and central filler material feed provide omni-directional additive laser processing capability.

Abstract: Laser processing systems and methods image a multiple core array to a work surface in a multiple processing beam array. An optical system separates processing beams and converges the beams toward the work surface and focuses each beam of the array at or near the work surface. A central axis with access for filler material flow to the work surface is provided. The processing beam array and central filler material feed provide omni-directional additive laser processing capability.

Abstract: Laser processing systems and methods image a multiple core array to a work surface in a multiple processing beam array. An optical system separates processing beams and converges the beams toward the work surface and focuses each beam of the array at or near the work surface. A central axis with access for filler material flow to the work surface is provided. The processing beam array and central filler material feed provide omni-directional additive laser processing capability.

Abstract: Laser processing systems and methods image a multiple core array to a work surface in a multiple processing beam array. An optical system separates processing beams and converges the beams toward the work surface and focuses each beam of the array at or near the work surface. A central axis with access for filler material flow to the work surface is provided. The processing beam array and central filler material feed provide omni-directional additive laser processing capability.

Abstract: Relay-based laser scanning systems and methods direct a converging input beam to a scanned output beam. A first beam deflector scans an image associated with the converging input along an arcuate intermediate image locus. A relay optic images the clear aperture of the first beam deflector to a second beam deflector and reimages the intermediate image from an internal conjugate distance to an external conjugate distance. Systems and methods may include an converging optic that converges the input to an image at the intermediate image locus. The converging optic may correct optical aberrations of the relay optic. The converging optic may be translated to change the radius of the intermediate image locus and vary the external conjugate distance. A scan head may have low inertia galvo-based scan mirrors. A controller may direct the scanned beam to predetermined points in a scan field. Material may be processed at multiple heights.

Abstract: Flat-field laser scanning lenses, systems, and methods with configurable focal length provide focus height accommodation. Lens elements are located by group at respective positions. Focal length configuration may be fixed, may be set, and may be adjusted. Systems include one or more beam deflectors configured to receive an input beam and deflect the input at scan angles, and a controller configured to generate scanning commands. The controller may be responsive to lens adjustments to direct the scanned beam to predetermined points in the scan field at multiple focus height settings. Methods include adjusting the focus height of a laser processing system with a lens focal length adjustment, and may include scaling scanning position commands to correlate commanded scan field positions with scan field positions at a focus height, adjusting the lens focal length in response to a sensor input, and sequentially focusing the lens at multiple workpiece heights.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.

Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A method of processing material of device elements by laser interaction is disclosed. According to one aspect, the method includes generating a pulsed laser processing output along a laser beam axis, the output including a plurality of laser pulses triggered sequentially at times determined by a pulse repetition rate. A trajectory relative to locations of device elements to be processed is generated. A position of one or more designated device elements relative to an intercept point position on the trajectory at one or more laser pulse times is determined, and a laser beam is deflected based on the predicted position within a predetermined deflection range. According to some aspects, the predetermined deflection range may correspond to a compass rose or cruciform field shape. As a result, a deflection accuracy for laser processing may be improved.

Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.

Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: In a system for severing conductive links by laser irradiation to repair electronic devices, multiple laser beams are deflected at high-speed to target selected links for processing by positioning laser spots in a two dimensional pattern during relative motion of a substrate and a beam delivery system. As link targeting flexibility is increased, selection may be required from a large number of addressable link pairs. Various embodiments advantageously use beam deflection and beam splitting to improve memory repair processing rates.

Abstract: Link processing systems and methods use controlled two dimensional deflection of a beam along an optical axis trajectory to process links positioned along and transverse to the trajectory during a pass of the optical axis along the trajectory. Predictive position calculations allow link blowing accuracy during constant velocity and accelerating trajectories.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.

Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.