Patents by Inventor Jonathan S. Haynes

Jonathan S. Haynes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stiffness reducing features in a top layer of a laminated top cover
    Patent number: 7787212
    Abstract: Stiffness reducing features for top covers of data storage systems are provided to prevent delaminating of top layers of the top covers. A top cover for a data storage system includes a bottom layer, a top layer and an adhesive layer that interconnects the top and bottom layers. At least one groove is formed in and extends along the top layer. The at least one groove reduces a thickness of the top layer along the at least one groove.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: August 31, 2010
    Assignee: Seagate Technology, LLC
    Inventors: Jonathan S. Haynes, Michael A. Finn
  • Acoustic damping pad that reduces deflection of a circuit board
    Patent number: 7742257
    Abstract: A acoustic damping pad is provided. The acoustic damping pad includes a first surface and an opposing second surface that are defined by a periphery. A first set of perforations extend between the first surface and the second surface of the acoustic damping pad. Each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and across a corresponding first select surface area of the opposing second surface to form a uniform pattern.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: June 22, 2010
    Assignee: Seagate Technology LLC
    Inventors: Edward G. Acciardi, A. David Michael, Jonathan S. Haynes, Kimberly C. Mann, Michael D. Leis
  • Stiffness Reducing Features in a Top Layer of a Laminated Top Cover
    Publication number: 20070206322
    Abstract: Stiffness reducing features for top covers of data storage systems are provided to prevent delaminating of top layers of the top covers. A top cover for a data storage system includes a bottom layer, a top layer and an adhesive layer that interconnects the top and bottom layers. At least one groove is formed in and extends along the top layer. The at least one groove reduces a thickness of the top layer along the at least one groove.
    Type: Application
    Filed: February 6, 2007
    Publication date: September 6, 2007
    Applicant: Maxtor Corporation
    Inventors: Jonathan S. Haynes, Michael A. Finn
  • Acoustic Damping Pad That Reduces Deflection of a Circuit Board
    Publication number: 20070165328
    Abstract: A acoustic damping pad is provided. The acoustic damping pad includes a first surface and an opposing second surface that are defined by a periphery. A first set of perforations extend between the first surface and the second surface of the acoustic damping pad. Each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and across a corresponding first select surface area of the opposing second surface to form a uniform pattern.
    Type: Application
    Filed: January 18, 2007
    Publication date: July 19, 2007
    Applicant: MAXTOR CORPORATION
    Inventors: Edward G. Acciardi, A. David Michael, Jonathan S. Haynes, Kimberly C. Mann, Michael D. Leis