Patents by Inventor Jonathan Sala

Jonathan Sala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9276302
    Abstract: A waveguide rotary joint includes a first waveguide portion for receiving a microwave signal, a second waveguide portion for outputting the received microwave signal, and a conductive pin including a first end and a second end distal from the first end, the first end arranged in and RF coupled to the first waveguide, and the second end arranged in and RF coupled to the second waveguide, and a choke cavity is arranged between the first waveguide portion and the second waveguide portion. The first waveguide and the second waveguide are rotatable relative to each other about a longitudinal axis of the conductive pin.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: March 1, 2016
    Assignee: ThinKom Solutions, Inc.
    Inventors: William Henderson, James Sor, William Milroy, Jonathan Sala
  • Publication number: 20150130565
    Abstract: A waveguide rotary joint includes a first waveguide portion for receiving a microwave signal, a second waveguide portion for outputting the received microwave signal, and a conductive pin including a first end and a second end distal from the first end, the first end arranged in and RF coupled to the first waveguide, and the second end arranged in and RF coupled to the second waveguide, and a choke cavity is arranged between the first waveguide portion and the second waveguide portion. The first waveguide and the second waveguide are rotatable relative to each other about a longitudinal axis of the conductive pin.
    Type: Application
    Filed: November 13, 2013
    Publication date: May 14, 2015
    Applicant: ThinKom Solutions, Inc.
    Inventors: William Henderson, James Sor, William Milroy, Jonathan Sala
  • Publication number: 20050100712
    Abstract: Methods and materials are described for the joining of plastics and other materials wherein polymerizable substances are diffused into the material to form a surface diffusion zone adjacent to the surface of the plastic workpiece to be joined. The surfaces are brought into contact and the polymerization reactions in the surface diffusion zone are initiated, creating thereby a strong bond across the contacting surfaces. High-performance engineered plastics such as polyetherimides, polyphenylenes, and polyether-ether-ketones are among the materials that are advantageously joined by this technique. Polymerizable substances including styrene and divinylbenzene are shown to give good bonds. Such joining methods can bond dissimilar materials difficult or impossible to join by other techniques. The surfaces to be joined are dry prior to initiation of the polymerization reaction, permitting repositioning and realignment of the surfaces as often as desired before joining.
    Type: Application
    Filed: November 12, 2003
    Publication date: May 12, 2005
    Inventors: Blake Simmons, Robert Crocker, Paul Dentinger, Marion Hunter, Kamlesh Patel, Jonathan Sala