Patents by Inventor JONATHAN SHANE ATIENZA

JONATHAN SHANE ATIENZA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11639957
    Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: May 2, 2023
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Kelsey McCusker, Stanley Katsuyoshi Wakamiya, Jonathan Shane Atienza, Jonathan Francis Van Dyke, Kevin Collao
  • Publication number: 20230003791
    Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 5, 2023
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: KELSEY McCUSKER, STANLEY KATSUYOSHI WAKAMIYA, JONATHAN SHANE ATIENZA, JONATHAN FRANCIS VAN DYKE, KEVIN COLLAO