Patents by Inventor Jonathan Stacey

Jonathan Stacey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12374657
    Abstract: The first logic wafer is attached to a supporting wafer, which adds sufficient depth to this bonded structure such that the first logic wafer may be thinned during the manufacturing process. The first logic wafer is thinned such that the through silicon vias may be etched in the substrate of the first logic wafer so as to provide adequate connectivity to a second logic wafer, which is bonded to the first logic wafer. The second logic wafer adds sufficient depth to this bonded structure to allow the supporting wafer to then be thinned to enable through silicon vias to be added to the supporting wafer so as to provide appropriate connectivity for the entire stacked structure. The thinned supporting wafer is retained in the finished stacked wafer structure and may comprise additional components (e.g. capacitors) supporting the operation of the processing circuitry in the logic wafers.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: July 29, 2025
    Assignee: GRAPHCORE LIMITED
    Inventors: Stephen Felix, Phillip Horsfield, Simon Jonathan Stacey
  • Publication number: 20210247345
    Abstract: In an embodiment a method includes forming a dielectric membrane on a semiconductor substrate comprising a bulk-etched cavity portion, forming a heater within or over the dielectric membrane, forming a material for sensing a gas on a side of the dielectric membrane, forming a support structure near the material, wherein the support structure comprises an inorganic material and forming a gas permeable region coupled to the support structure in order to protect the material.
    Type: Application
    Filed: April 29, 2021
    Publication date: August 12, 2021
    Inventors: Syed Zeeshan Ali, Matthew Govett, Simon Jonathan Stacey
  • Patent number: 11022576
    Abstract: A gas sensor with a gas permeable region is disclosed. In an embodiment a gas sensor includes a dielectric membrane formed on a semiconductor substrate having a cavity portion, a heater located within or over the dielectric membrane, a material for sensing a gas, wherein the material is located on one side of the dielectric membrane, a support structure located near the material, a gas permeable membrane coupled to the support structure so as to protect the material, wherein the semiconductor substrate forms the support structure.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: June 1, 2021
    Assignee: Sciosense B.V.
    Inventors: Syed Zeeshan Ali, Matthew Govett, Simon Jonathan Stacey
  • Patent number: 10928372
    Abstract: We disclose herein an electronic device comprising: a state machine for receiving an output signal from a sensor; a comparator operatively coupled with the state machine; and a first processor operatively coupled with the comparator. The state machine is configured to receive the output signal from the at least one sensor to obtain sensor measurement data and configured to pass the obtained sensor measurement data to the comparator. The comparator is configured to process the obtained sensor measurement data into first processed sensor data, and configured to compare the first processed sensor data with a first predetermined threshold limit. The comparator is configured to inform the first processor about the obtained sensor measurement data if the first processed sensor data exceed the first predetermined threshold limit.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: February 23, 2021
    Assignee: AMS SENSORS UK LIMITED
    Inventors: Douglas James McMillan, Clinton Sean Dixon, Simon Jonathan Stacey
  • Patent number: 10705040
    Abstract: We disclose herein a method for heating a gas sensing material formulation on a microhotplate which comprises: a dielectric membrane formed on a semiconductor substrate comprising an etched portion; and the gas sensing material formulation being located on one side of the dielectric membrane. The method comprising: selectively heating the gas sensing material formulation using an infra-red (IR) heater located over the substrate, and controllably cooling the semiconductor substrate using a cooling baseplate provided under the substrate and using an insulating medium located between the substrate and the cooling base plate so that a gas sensing structure is formed on said one side of the dielectric membrane from the gas sensing material formulation.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: July 7, 2020
    Assignee: Sciosense B.V.
    Inventors: Simon Jonathan Stacey, Matthew Govett, Syed Zeeshan Ali
  • Publication number: 20200150069
    Abstract: A gas sensing device comprising a substrate comprising an etched cavity portion and a substrate portion; a dielectric layer disposed on the substrate. The dielectric layer comprises a dielectric membrane. The dielectric membrane is adjacent to the etched cavity portion of the substrate. The dielectric membrane comprises an etched recess portion, a heater located within the dielectric layer, and a material for sensing a gas. The material for sensing a gas is located within the etched recess portion of the dielectric membrane.
    Type: Application
    Filed: November 12, 2018
    Publication date: May 14, 2020
    Inventors: Florin Udrea, Syed Zeeshan Ali, Simon Jonathan Stacey
  • Patent number: 10429329
    Abstract: We disclose herein a method for testing a batch of environmental sensors to determine the fitness for purpose of the batch of environmental sensors, the method comprising: performing a plurality of electrical test sequences to the sensor inputs of the batch of environmental sensors to measure electrical responses of the sensor outputs of the batch of environmental sensors; correlating the measured electrical responses from the batch of environmental sensors to predetermined environmental parametric ranges of at least one environmental sensor so as to define correlated electrical test limits; and determining the fitness for purpose of the batch of environmental sensors if the measured electrical responses are within the correlated electrical test limits.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: October 1, 2019
    Assignee: AMS SENSORS UK LIMITED
    Inventors: Simon Jonathan Stacey, Kaspars Ledins, Matthew Govett
  • Patent number: 10288575
    Abstract: We disclose herein an environmental sensor system comprising an environmental sensor comprising a first heater and a second heater in which the first heater is configured to consume a lower power compared to the second heater. The system also comprises a controller coupled with the environmental sensor. The controller is configured to detect if a measured value of a targeted environmental parameter is present. The controller is configured to switch on at least one of the first and second heaters based on the presence and/or result of the measured value of the targeted environmental parameter.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: May 14, 2019
    Assignee: AMS SENSORS UK LIMITED
    Inventors: Syed Zeeshan Ali, Simon Jonathan Stacey, Florin Udrea
  • Publication number: 20190041346
    Abstract: We disclose herein a method for heating a gas sensing material formulation on a microhotplate which comprises: a dielectric membrane formed on a semiconductor substrate comprising an etched portion; and the gas sensing material formulation being located on one side of the dielectric membrane. The method comprising: selectively heating the gas sensing material formulation using an infra-red (IR) heater located over the substrate, and controllably cooling the semiconductor substrate using a cooling baseplate provided under the substrate and using an insulating medium located between the substrate and the cooling base plate so that a gas sensing structure is formed on said one side of the dielectric membrane from the gas sensing material formulation.
    Type: Application
    Filed: December 13, 2016
    Publication date: February 7, 2019
    Inventors: Simon Jonathan Stacey, Matthew Govett, Syed Zeeshan Ali
  • Publication number: 20170343502
    Abstract: We disclose herein an environmental sensor system comprising an environmental sensor comprising a first heater and a second heater in which the first heater is configured to consume a lower power compared to the second heater. The system also comprises a controller coupled with the environmental sensor. The controller is configured to detect if a measured value of a targeted environmental parameter is present. The controller is configured to switch on at least one of the first and second heaters based on the presence and/or result of the measured value of the targeted environmental parameter.
    Type: Application
    Filed: May 31, 2016
    Publication date: November 30, 2017
    Inventors: Syed Zeeshan Ali, Simon Jonathan Stacey, Florin Udrea
  • Publication number: 20170219506
    Abstract: We disclose herein a method for testing a batch of environmental sensors to determine the fitness for purpose of the batch of environmental sensors, the method comprising: performing a plurality of electrical test sequences to the sensor inputs of the batch of environmental sensors to measure electrical responses of the sensor outputs of the batch of environmental sensors; correlating the measured electrical responses from the batch of environmental sensors to predetermined environmental parametric ranges of at least one environmental sensor so as to define correlated electrical test limits; and determining the fitness for purpose of the batch of environmental sensors if the measured electrical responses are within the correlated electrical test limits.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 3, 2017
    Inventors: Simon Jonathan Stacey, Kaspars Ledins, Matthew Govett
  • Publication number: 20170219544
    Abstract: We disclose herein an electronic device comprising: a state machine for receiving an output signal from a sensor; a comparator operatively coupled with the state machine; and a first processor operatively coupled with the comparator. The state machine is configured to receive the output signal from the at least one sensor to obtain sensor measurement data and configured to pass the obtained sensor measurement data to the comparator. The comparator is configured to process the obtained sensor measurement data into first processed sensor data, and configured to compare the first processed sensor data with a first predetermined threshold limit. The comparator is configured to inform the first processor about the obtained sensor measurement data if the first processed sensor data exceed the first predetermined threshold limit.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 3, 2017
    Inventors: Douglas James McMillan, Clinton Sean Dixon, Simon Jonathan Stacey
  • Patent number: 9659894
    Abstract: A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, and buffer layers having a Young's Modulus of 2.5 GPa or less.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: May 23, 2017
    Assignee: QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
    Inventor: Simon Jonathan Stacey
  • Patent number: 9410344
    Abstract: In some embodiments of the invention, a security apparatus for a portable electronic device is provided. The security apparatus may include a plurality of interlocking shell portions, wherein the interlocking shell portions are shaped to, when interlocked, wrap around at least part of a perimeter of the portable electronic device, and wherein at least two shell portions comprise an aperture. The security apparatus may also include an attachment device configured to be at least partly inserted into the apertures of the at least two shell portions.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: August 9, 2016
    Assignee: ACCO Brands Corporation
    Inventors: Jonathan Stacey, Jonathan Corpuz, Dominic Peralta, Stephen Myers
  • Publication number: 20160195897
    Abstract: A docking station includes a first port configured to couple to a display, a second port configured to couple to a peripheral device, a first connector configured to receive a first video signal from a first electronic device, and a second connector configured to receive a second video signal from a second electronic device. The docking station also includes a control circuit having a video processor operable to decompress video signals, a first electrical communication path formed by the first connector and the first port, and a second electrical communication path formed by the second connector, the video processor, and the first port. The first electrical communication path selectively transmits the first video signal from the first connector to the first port, and the second electrical communication path selectively transmits the second video signal from the second connector, through the video processor, and to the first port.
    Type: Application
    Filed: December 31, 2015
    Publication date: July 7, 2016
    Inventors: Todd C. Robinson, Louie Yao, Jonathan Stacey
  • Patent number: 9316026
    Abstract: A security apparatus for a portable electronic device is provided. The security apparatus may include a plurality of shell portions, each shaped to wrap around part of a perimeter of the portable electronic device. The security apparatus may further include a connecting portion that engages at least one of the plurality of shell portions and to thereby couple the plurality of shell portions to each other. At least one of the connecting portion and one or more of the plurality of shell portions may include an attachment device, the attachment device being configured to engage with a locking head, thereby locking relative positions of the plurality of shell portions and the connecting portion.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: April 19, 2016
    Assignee: ACCO Brands Corporation
    Inventors: Stephen Myers, Jonathan Corpuz, Jonathan Stacey
  • Publication number: 20160086907
    Abstract: A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, and buffer layers having a Young's Modulus of 2.5 GPa or less.
    Type: Application
    Filed: August 27, 2015
    Publication date: March 24, 2016
    Inventor: Simon Jonathan Stacey
  • Patent number: 9177885
    Abstract: A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, said buffer layers having a Young's Modulus of 2.5GPa or less.
    Type: Grant
    Filed: November 26, 2007
    Date of Patent: November 3, 2015
    Assignee: Cambridge Silicon Radio Limited
    Inventor: Simon Jonathan Stacey
  • Patent number: 9141145
    Abstract: A security apparatus for securing a portable device includes a housing having a first housing portion configured to partially surround a first portion of the portable device, and a second housing portion configured to partially surround a second portion of the portable device. The second housing portion is selectively secured to the first housing portion when the housing is engaged with the portable device. The security apparatus also includes an attachment device extending from the housing. The attachment device is configured to engage a locking head. The security apparatus further includes a modular accessory coupled to the housing. The modular accessory is connected to the housing when the first and second housing portions are secured together to surround the portable device. The modular accessory is only removable from the housing when the first and second housing portions are disconnected from the portable electronic device.
    Type: Grant
    Filed: January 20, 2014
    Date of Patent: September 22, 2015
    Assignee: ACCO Brands Corporation
    Inventors: Ryan White, A. John Venida, Jonathan Stacey, Wilson Shu Chiu Tse
  • Patent number: 9087795
    Abstract: An electrical interconnect for connecting an IC chip to a PCB, the electrical interconnect comprising a plurality of connection elements for connection to the PCB attached to a first surface of the electrical interconnect, wherein the amount of thermal and/or mechanical stress that each solder element connection can take before failing is improved.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: July 21, 2015
    Assignee: Cambridge Silicon Radio Limited
    Inventor: Simon Jonathan Stacey