Patents by Inventor Jonathan T. SHAW

Jonathan T. SHAW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11101357
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: August 24, 2021
    Assignee: Tessera, Inc.
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Publication number: 20200365702
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 10734492
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: August 4, 2020
    Assignee: Tessera, Inc.
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Publication number: 20190296120
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Application
    Filed: June 13, 2019
    Publication date: September 26, 2019
    Inventors: Anthony I. CHOU, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 10381452
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: August 13, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 10374048
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: August 6, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 10367072
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: July 30, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 9922831
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: March 20, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Publication number: 20180076039
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Application
    Filed: November 15, 2017
    Publication date: March 15, 2018
    Inventors: Anthony I. CHOU, Arvind KUMAR, Chung-Hsun LIN, Shreesh NARASIMHA, Claude ORTOLLAND, Jonathan T. SHAW
  • Publication number: 20180061645
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Application
    Filed: October 30, 2017
    Publication date: March 1, 2018
    Inventors: Anthony I. CHOU, Arvind KUMAR, Chung-Hsun LIN, Shreesh NARASIMHA, Claude ORTOLLAND, Jonathan T. SHAW
  • Publication number: 20180061646
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Application
    Filed: October 23, 2017
    Publication date: March 1, 2018
    Inventors: Anthony I. CHOU, Arvind KUMAR, Chung-Hsun LIN, Shreesh NARASIMHA, Claude ORTOLLAND, Jonathan T. SHAW
  • Patent number: 9859122
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 2, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 9837319
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: December 5, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 9768071
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: September 19, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 9721843
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: August 1, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Publication number: 20170178913
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Application
    Filed: March 6, 2017
    Publication date: June 22, 2017
    Inventors: Anthony I. CHOU, Arvind KUMAR, Chung-Hsun LIN, Shreesh NARASIMHA, Claude ORTOLLAND, Jonathan T. SHAW
  • Patent number: 9685379
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: June 20, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Publication number: 20170125542
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Application
    Filed: January 13, 2017
    Publication date: May 4, 2017
    Inventors: Anthony I. CHOU, Arvind KUMAR, Chung-Hsun LIN, Shreesh NARASIMHA, Claude ORTOLLAND, Jonathan T. SHAW
  • Patent number: 9577061
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: February 21, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw
  • Patent number: 9570354
    Abstract: An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: February 14, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony I. Chou, Arvind Kumar, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw