Patents by Inventor Jonathan Tan

Jonathan Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10504172
    Abstract: Systems and methods including one or more processing modules and one or more non-transitory storage modules storing computing instructions configured to run on the one or more processing modules and perform acts of determining that content for a product in an electronic catalog for display on a webpage of an online retailer comprises incorrect content or is missing content, coordinating a first display on mobile electronic devices of a plurality of users of a request to provide additional content that (1) replaces the incorrect content for the product in the electronic catalog or (2) provides the missing content for the product in the electronic catalog, receiving the additional content for the product from the mobile electronic devices of the plurality of users, and coordinating a second display of the additional information of the product on the one or more webpages of the online retailer.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: December 10, 2019
    Assignee: WALMART APOLLO, LLC
    Inventors: Jonathan Tan, Ganesh Krishnan, Scott Fish, Rohit Deep
  • Patent number: 10446523
    Abstract: A semiconductor device has a substrate and semiconductor die disposed over a first surface of the substrate. A wire stud is attached to the first surface of the substrate. The wire stud includes a base portion and stem portion. A bonding pad is formed over a second surface of the substrate. An encapsulant is deposited over the substrate, semiconductor die, and wire stud. A portion of the encapsulant is removed by LDA to expose the wire stud. A portion of the encapsulant is removed by LDA to expose the substrate. An interconnect structure is formed over the encapsulant and electrically connected to the wire stud and semiconductor die. A bump is formed over the interconnect structure. A semiconductor package is disposed over the encapsulant and electrically connected to the substrate. A discrete semiconductor device is disposed over the encapsulant and electrically connected to the substrate.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: October 15, 2019
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Pandi C. Marimuthu, Sheila Marie L. Alvarez, Yaojian Lin, Jose A. Caparas, Yang Kern Jonathan Tan
  • Publication number: 20180211302
    Abstract: Systems and methods including one or more processing modules and one or more non-transitory storage modules storing computing instructions configured to run on the one or more processing modules and perform acts of selecting a plurality of products of an online retailer, receiving first manual categorizations of the plurality of products from a plurality of users, preparing a machine learning model for automatically categorizing additional products based on the first manual categorizations of the plurality of products, receiving a product description for an additional product, automatically categorizing the additional product into one or more categories for display on a webpage of the online retailer based on the product description of the first additional product using the machine learning model, and coordinating the display of the webpage of the online retailer of the additional product.
    Type: Application
    Filed: January 24, 2017
    Publication date: July 26, 2018
    Applicant: WAL-MART STORES, INC.
    Inventors: Abhinandan Krishnan, Jonathan Tan, Jianhui Zhang
  • Publication number: 20180197230
    Abstract: Systems and methods including one or more processing modules and one or more non-transitory storage modules storing computing instructions configured to run on the one or more processing modules and perform acts of determining that content for a product in an electronic catalog for display on a webpage of an online retailer comprises incorrect content or is missing content, coordinating a first display on mobile electronic devices of a plurality of users of a request to provide additional content that (1) replaces the incorrect content for the product in the electronic catalog or (2) provides the missing content for the product in the electronic catalog, receiving the additional content for the product from the mobile electronic devices of the plurality of users, and coordinating a second display of the additional information of the product on the one or more webpages of the online retailer.
    Type: Application
    Filed: January 9, 2017
    Publication date: July 12, 2018
    Applicant: WAL-MART STORES, INC.
    Inventors: Jonathan Tan, Ganesh Krishnan, Scott Fish, Rohit Deep
  • Publication number: 20160336299
    Abstract: A semiconductor device has a substrate and semiconductor die disposed over a first surface of the substrate. A wire stud is attached to the first surface of the substrate. The wire stud includes a base portion and stem portion. A bonding pad is formed over a second surface of the substrate. An encapsulant is deposited over the substrate, semiconductor die, and wire stud. A portion of the encapsulant is removed by LDA to expose the wire stud. A portion of the encapsulant is removed by LDA to expose the substrate. An interconnect structure is formed over the encapsulant and electrically connected to the wire stud and semiconductor die. A bump is formed over the interconnect structure. A semiconductor package is disposed over the encapsulant and electrically connected to the substrate. A discrete semiconductor device is disposed over the encapsulant and electrically connected to the substrate.
    Type: Application
    Filed: July 25, 2016
    Publication date: November 17, 2016
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Pandi C. Marimuthu, Sheila Marie L. Alvarez, Yaojian Lin, Jose A. Caparas, Yang Kern Jonathan Tan
  • Patent number: 9443797
    Abstract: A semiconductor device has a substrate and semiconductor die disposed over a first surface of the substrate. A wire stud is attached to the first surface of the substrate. The wire stud includes a base portion and stem portion. A bonding pad is formed over a second surface of the substrate. An encapsulant is deposited over the substrate, semiconductor die, and wire stud. A portion of the encapsulant is removed by LDA to expose the wire stud. A portion of the encapsulant is removed by LDA to expose the substrate. An interconnect structure is formed over the encapsulant and electrically connected to the wire stud and semiconductor die. A bump is formed over the interconnect structure. A semiconductor package is disposed over the encapsulant and electrically connected to the substrate. A discrete semiconductor device is disposed over the encapsulant and electrically connected to the substrate.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 13, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Pandi C. Marimuthu, Sheila Marie L. Alvarez, Yaojian Lin, Jose A. Caparas, Yang Kern Jonathan Tan
  • Patent number: 8812663
    Abstract: A network delay estimation apparatus capable of creating a metric tree with high accuracy and in a short time. Network delay estimation apparatus (302) includes first-round measurement target node selection section (306) that selects one pair or a plurality of pairs of nodes located at a long distance from each other from a known metric tree as first-round measurement target nodes and measures a distance from an arbitrary node, second-round measurement target node selection section (310) that selects a node whose distance from the arbitrary node is estimated to be short as a second-round measurement target based on the distance and a known metric tree and measures a distance from the arbitrary node, and an optimum tree processing section (314) that creates a network metric tree including the arbitrary node based on the distance and the known metric tree.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: August 19, 2014
    Assignee: Panasonic Corporation
    Inventors: Jonathan Tan Ming Yu, Boon Ping Lim, Ettikan Kandasamy Karuppiah, Eiichi Muramoto
  • Patent number: 8757516
    Abstract: A self-contained portable liquid cosmetic delivery system for both color makeup and skin care applications is provided. The system includes a spray nozzle assembly having both a liquid path and air path communicates with the housing containing a peristaltic and diaphragm pumping systems. A removable cartridge assembly that allows for very quick changing of cosmetic, while also including a cartridge housing that not only configured to enable the use of a peristaltic pump and diaphragm pump to selectively dispense liquid cosmetic contained in the cartridge housing, it can be manufactured at a reduced cost thus making the same easily cleanable and essentially disposable.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: June 24, 2014
    Inventors: Peter Spiegel, Jonathan Tan
  • Publication number: 20140077364
    Abstract: A semiconductor device has a substrate and semiconductor die disposed over a first surface of the substrate. A wire stud is attached to the first surface of the substrate. The wire stud includes a base portion and stem portion. A bonding pad is formed over a second surface of the substrate. An encapsulant is deposited over the substrate, semiconductor die, and wire stud. A portion of the encapsulant is removed by LDA to expose the wire stud. A portion of the encapsulant is removed by LDA to expose the substrate. An interconnect structure is formed over the encapsulant and electrically connected to the wire stud and semiconductor die. A bump is formed over the interconnect structure. A semiconductor package is disposed over the encapsulant and electrically connected to the substrate. A discrete semiconductor device is disposed over the encapsulant and electrically connected to the substrate.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 20, 2014
    Applicant: STATS CHIPPAC, LTD.
    Inventors: Pandi C. Marimuthu, Sheila Marie L. Alvarez, Yaojian Lin, Jose A. Caparas, Yang Kern Jonathan Tan
  • Publication number: 20120198060
    Abstract: A network delay estimation apparatus capable of creating a metric tree with high accuracy and in a short time. Network delay estimation apparatus (302) includes first-round measurement target node selection section (306) that selects one pair or a plurality of pairs of nodes located at a long distance from each other from a known metric tree as first-round measurement target nodes and measures a distance from an arbitrary node, second-round measurement target node selection section (310) that selects a node whose distance from the arbitrary node is estimated to be short as a second-round measurement target based on the distance and a known metric tree and measures a distance from the arbitrary node, and an optimum tree processing section (314) that creates a network metric tree including the arbitrary node based on the distance and the known metric tree.
    Type: Application
    Filed: February 25, 2011
    Publication date: August 2, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Jonathan Tan Ming Yu, Boon Ping Lim, Ettikan Kandasamy Karuppiah, Eiichi Muramoto
  • Publication number: 20120067977
    Abstract: A self-contained portable liquid cosmetic delivery system for both color makeup and skin care applications is provided. The system includes a spray nozzle assembly having both a liquid path and air path communicates with the housing containing a peristaltic and diaphragm pumping systems. A removable cartridge assembly that allows for very quick changing of cosmetic, while also including a cartridge housing that not only configured to enable the use of a peristaltic pump and diaphragm pump to selectively dispense liquid cosmetic contained in the cartridge housing, it can be manufactured at a reduced cost thus making the same easily cleanable and essentially disposable.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 22, 2012
    Inventors: Peter SPIEGEL, Jonathan Tan