Patents by Inventor Jonathan Tappan

Jonathan Tappan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reliability of vias and diagnosis by e-beam probing
    Patent number: 6573735
    Abstract: Electronic devices, such as IC devices, are tested by determining a failure net within the electronic device that is causing a device failure. After identifying the failure net, the failure net is locally stressed. The stress is applied so that only the net being tested is subjected to the stress, and the remaining nets and components of the device are not stressed. A change in a signal produced by the failure net is observed while the failure net is being subjected to the stress. Testing in this manner assists in identifying the failure net as a failure source of the device.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: June 3, 2003
    Assignee: Qualcomm Incorporated
    Inventors: William Xia, Martin Villafana, Jonathan Tappan, Tim Watson, Michael Campbell
  • Reliability of vias and diagnosis by E-beam probing
    Publication number: 20020186028
    Abstract: Electronic devices, such as IC devices, are tested by determining a failure net within the electronic device that is causing a device failure. After identifying the failure net, the failure net is locally stressed. The stress is applied so that only the net being tested is subjected to the stress, and the remaining nets and components of the device are not stressed. A change in a signal produced by the failure net is observed while the failure net is being subjected to the stress. Testing in this manner assists in identifying the failure net as a failure source of the device.
    Type: Application
    Filed: June 8, 2001
    Publication date: December 12, 2002
    Inventors: William Xia, Martin Villafana, Jonathan Tappan, Tim Watson, Michael Campbell