Abstract: Disclosed is a polyimide film that exhibits: an in-plane coefficient of thermal expansion (CTE) that is less than 75 ppm/° C. between 50° C. and 250° C.; a glass transition temperature (Tg) that is greater than 250° C. for the polyimide film cured at 260° C. in air; a 1% TGA weight loss temperature that is greater than 450° C.; a tensile modulus that is between 1.5 GPa and 5.0 GPa; an elongation to break that is greater than 20%; an optical retardation at 550 nm that is less than 100 nm for a 10-?m film; a birefringence at 633 nm that is less than 0.002; a haze that is less than 1.0%; a b* that is less than 3; a yellowness index that is less than 5; and an average transmittance between 380 nm and 780 nm that is greater than 88%.

Abstract: Disclosed is a polyimide film generated from a solution containing a polyamic acid in a high-boiling, aprotic solvent; wherein the polyamic acid comprises one or more tetracarboxylic acid components and one or more diamine components; and wherein at least one of the tetracarboxylic acid components is a quadrivalent organic group derived from a bent dianhydride or an aromatic dianhydride comprising —O—, —CO—, —NHCO—, —S—, —SO2—, —CO—O—, or —CR2— links, or a direct chemical bond between aromatic rings; and wherein at least one of the diamine components is a divalent organic group derived from a bent diamine or an aromatic diamine comprising the same links, or a direct chemical bond between aromatic rings; and wherein R is the same or different at each occurrence and is selected from the group consisting of H, F, alkyl, and fluoroalkyl.