Patents by Inventor Jonathan W Craig

Jonathan W Craig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit device package including multiple stacked components
    Patent number: 6477058
    Abstract: An integrated circuit device package in accordance with the invention comprises a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated circuit device and a first side of a first circuit board; a second LGA interposer socket positioned between, and in communication with, a second circuit board and a second side of the first circuit board, wherein the second side of the first circuit board is opposite to and parallel with the first side of the first circuit board; and a clamping mechanism for compressively urging together the LGA integrated circuit device, the first LGA interposer socket, the first circuit board, the second LGA interposer socket, and the second circuit board into electrical interconnection under a predetermined load.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: November 5, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Richard J Luebs, Jonathan W Craig, Jeffrey L. Deeney, David W. Peters