Abstract: A collar comprising a top surface having a legend capable of being read by a reading device, a collar body and an inner wall configured to surround and secure the collar to an object placed within a slot defined by the inner wall.

Abstract: A collar comprising a top surface having a legend capable of being read by a reading device, a collar body and an inner wall configured to surround and secure the collar to an object placed within a slot defined by the inner wall.

Abstract: A mounting system for an integrated circuit employs a novel load cell having a backing plate, a bow spring and a load distribution plate. The load cell controls the loading forces on contacts of an integrated circuit socket. A heat sink having a base includes a pedestal extending from the base that abuts the integrated circuit for purposes of heat removal. Springs are employed to provide loading forces for the heat sink that are lower than the loading forces for the integrated circuit socket contacts.

Abstract: An electrical connector assembly is provided including first and second circuit boards proximate each other and each having a first side and a second side. The electrical connector assembly includes flex circuits electrically connected to the first and second sides of the first and second circuit boards and carrying electrical signals therebetween. The electrical connector assembly includes load cells having at least one bowed spring, a base plate, and a cover plate. The spring has a peak portion and end portions and is compressed between the base and cover plates. The peak portion engages one of the base and cover plates with the end portions engaging another of the base and cover plates to exert a load force on the base and cover plates. The load cells are aligned opposite each other on the first and second circuit boards and retain the flex circuits thereto.

Abstract: A method and apparatus for mounting a lidless semiconductor device. A lidless semiconductor device, such as a land grid array device comprising a substrate having a semiconductor die mounted thereon is disposed in a socket. The socket includes a plurality of resilient conductive members arranged in a predetermined contact array pattern for conductively coupling conductive contacts on a printed circuit board with corresponding contacts on the underside of the lidless semiconductor device. A first set of springs applies a predetermined force to the substrate to conductively couple the contacts on the substrate to the contacts on the printed circuit board via the conductive members of the socket. Another set of springs urges the bottom surface of a heat sink into thermally conductive abutting relation with the top surface of the semiconductor die. The pressure on the die is less than the pressure applied by the substrate so as to avoid damage to the semiconductor die.

Abstract: A method for securing a contact assembly to a frame in an integrated circuit socket via cold forming. A plurality of posts are integrally formed with and extend from the bottom surface of the frame of an integrated circuit device socket. The contact assembly includes a plurality of conductive columns mounted within an insulating sheet in a predetermined contact pattern. The insulating sheet also has a plurality of post receiving apertures that are selectively positioned such that the posts extend through corresponding apertures in the insulating sheet when the contact assembly is positioned in a mounting position on the bottom surface of the frame. The posts are cold staked to expand the diameter of the post ends and to secure the contact assembly to the frame.

Abstract: An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.

Abstract: A socket for an LGA or BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of the package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes elements for soldering or bonding the socket to a circuit board.

Abstract: A socket for a BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of a BGA package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes latch elements for retaining the contact assembly on the frame. The socket is mounted onto a printed circuit board which has an array of contact areas corresponding to the array of resilient contacts of the socket.

Abstract: A Land Grid Array (LGA) clamp mechanism is presented. The mechanism includes a spring having a number of beams that mate with cooperating posts from a backing plate. The backing plate fits on the bottom side of a printed circuit board, opposite the area where a device is installed with the posts extending from the backing plate and through the printed circuit board. The LGA device is either inserted into a socket on the top side of the printed circuit board or mounted directly to the top side of the printed circuit board. A heat sink is placed directly on top of the LGA device. The posts from the backing plate extend through the circuit board and through the heatsink. A spring assembly is positioned along a top surface of the heatsink and is secured to the posts. The spring assembly includes a spring and a bias adjustment screw that is adjusted to provide a desired uniform amount of pressure to the heatsink, device and socket.

Abstract: An electrical interconnect comprising a non-conductive substrate having respective opposite surfaces and a plurality of apertures formed therein extending between the respective opposite surfaces, and a corresponding plurality of elastic conductive interconnect elements located within the plurality of apertures, in which each elastic conductive interconnect element extends between the respective opposite surfaces of the substrate. Each elastic conductive interconnect element is formed of a non-conductive elastic material having a quantity of conductive flakes and a quantity of conductive powder granules interspersed therein. The interconnect elements can be integrally molded in the substrate or separately formed and inserted in the substrate.

Abstract: Several different types of electrically conductive elastomers are disclosed along with the methods for their fabrication. In one particular embodiment, a layered composition is disclosed which comprises a substrate, a first layer, and a second layer. The substrate is formed of a non-conductive elastic material and it has an outer surface. The first layer, which is formed with a non-conductive elastic material, is grafted to the outer surface of the substrate. The second layer, which is formed with a non-conductive elastic material having a quantity of conductive flakes interspersed therein, is grafted to an outer surface of the first layer. The second layer can further be formed with a quantity of rounded or jagged conductive particles interspersed in the non-conductive elastic material such that some of the conductive particles are present along an outer surface of the second layer. Alternatively, a quantity of rounded or jagged conductive particles may be imbedded in an outer surface of the second layer.