Abstract: An acoustic sensor array may include sensor sections positioned along a length of a strain member. One or more sensors may be disposed within a sensor section. One or more sensors may be encapsulated in a molding material using a reaction injection molding (RIM) process to form a sensor section. Buoyant sections may be formed between sensor sections on the strain member. Buoyant sections may be formed by encapsulating a portion of the strain member in a buoyant molding material using a RIM process. Buoyant sections and/or sensor sections may include hollow microspheres. A concentration of hollow microspheres may be adjusted to control a buoyancy of the array. The strain member, the sensor sections, and the buoyant sections may be joined to form the array.

Abstract: An acoustic sensor may include a base, a diaphragm, and a piezoelectric film. A cup may be disposed around the sensor. A filling material may be injected inside the cup and around the sensor. An end cap may be placed at an end of the cup to enclose the filling material within the cup. The cup may include longitudinal fibers disposed in an adhesive matrix. The acoustic sensor and the cup may be encapsulated in a molding material using a reaction injection molding (RIM) process to form a sensor section. Buoyant sections may be formed between sensor sections on a strain member. Buoyant sections may be formed by encapsulating a portion of the strain member in a buoyant molding material using a RIM process. be The strain member, the sensor sections, and the buoyant sections may be joined to form an array.

Abstract: An acoustic sensor array may include sensor sections positioned along a length of a strain member. One or more sensors may be disposed within a sensor section. One or more sensors may be encapsulated in a molding material using a reaction injection molding (RIM) process to form a sensor section. Buoyant sections may be formed between sensor sections on the strain member. Buoyant sections may be formed by encapsulating a portion of the strain member in a buoyant molding material using a RIM process. Buoyant sections and/or sensor sections may include hollow microspheres. A concentration of hollow microspheres may be adjusted to control a buoyancy of the array. The strain member, the sensor sections, and the buoyant sections may be joined to form the array.