Patents by Inventor Jonathan W. Thibado

Jonathan W. Thibado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9603276
    Abstract: Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: March 21, 2017
    Assignee: Intel Corporation
    Inventors: David J. Llapitan, Jeffory L. Smalley, Gaurav Chawla, Joshua D Heppner, Vijaykumar Krithivasan, Jonathan W. Thibado, Kuang Liu, Gregorio Murtagian
  • Publication number: 20160190716
    Abstract: Some forms relate to a socket having a housing. A first receiving pin field is formed as part of the housing. The first pin receiving field includes a first plurality of electrical contacts. A second receiving pin field is formed as part of the housing. The second pin field includes a second plurality of electrical contacts. An actuation mechanism is configured to engage the first plurality electrical contacts with a first set of pins on a first electronic package and the second plurality electrical contacts with a second set of pins on a second electronic package.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 30, 2016
    Inventors: Kuang Liu, Gregorio Murtagian, David J. Llapitan, Jeffory L. Smalley, Gaurav Chawla, Joshua D. Heppner, Vijaykumar Krithivasan, Jonathan W. Thibado
  • Publication number: 20160190717
    Abstract: Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 30, 2016
    Inventors: David J. Llapitan, Jeffory L. Smalley, Gaurav Chawla, Joshua D. Heppner, Vijaykumar Krithivasan, Jonathan W. Thibado, Kuang Liu, Gregorio Murtagian
  • Publication number: 20160183374
    Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 23, 2016
    Inventors: Mani Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram S. Viswanath, Bassam N. Coury, Dimitrios Ziakas, Chong J. Zhao, Jonathan W. Thibado, Gregorio R. Murtagian, Kuang C. Liu, Rajasekaran Swaminathan, Zhichao Zhang, John M. Lynch, David J. Llapitan, Sanka Ganesan, Xiang Li, George Vergis
  • Publication number: 20040040575
    Abstract: A brush assembly includes a first brush having a central portion and end portions. The central portion is recessed from the end portions. A second brush is provided having an outer surface and opposed to the first brush. The first brush and the second brush are adapted to receive a planar object therebetween. The outer surface and the end portions are in contact with the planar object and the central portion avoids contact with the planar object.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 4, 2004
    Inventors: Alexander Tregub, Jamie Ludke, Mark P. McGhee, Mansour Moinpour, Joseph W. Parks, Jade Sun, Jonathan W. Thibado