Abstract: A heat exchanger that transfers heat from an exhaust gas flow to a liquid coolant includes a first heat exchange section and a second heat exchange section located adjacent the first heat exchange section. The first heat exchange section is located within a first housing that at least partially encloses a first fluid volume. The second heat exchange section is located within a second housing that at least partially encloses a second fluid volume. A first plurality of heat exchange tubes traverses the first heat exchange section, and a second plurality of heat exchange tubes traverses the second heat exchange section. An exhaust gas flow path of the heat exchanger includes the first fluid volume and the interiors of the second plurality of heat exchange tubes. A coolant flow path of the heat exchanger includes the second fluid volume and the interiors of the first plurality of heat exchange tubes.

Abstract: A heat exchanger that transfers heat from an exhaust gas flow to a liquid coolant includes a first heat exchange section and a second heat exchange section located adjacent the first heat exchange section. The first heat exchange section is located within a first housing that at least partially encloses a first fluid volume. The second heat exchange section is located within a second housing that at least partially encloses a second fluid volume. A first plurality of heat exchange tubes traverses the first heat exchange section, and a second plurality of heat exchange tubes traverses the second heat exchange section. An exhaust gas flow path of the heat exchanger includes the first fluid volume and the interiors of the second plurality of heat exchange tubes. A coolant flow path of the heat exchanger includes the second fluid volume and the interiors of the first plurality of heat exchange tubes.

Abstract: A heat exchanger that transfers heat from an exhaust gas flow to a liquid coolant includes a first heat exchange section and a second heat exchange section located adjacent the first heat exchange section. The first heat exchange section is located within a first housing that at least partially encloses a first fluid volume. The second heat exchange section is located within a second housing that at least partially encloses a second fluid volume. A first plurality of heat exchange tubes traverses the first heat exchange section, and a second plurality of heat exchange tubes traverses the second heat exchange section. An exhaust gas flow path of the heat exchanger includes the first fluid volume and the interiors of the second plurality of heat exchange tubes. A coolant flow path of the heat exchanger includes the second fluid volume and the interiors of the first plurality of heat exchange tubes.

Abstract: A heat exchanger that transfers heat from an exhaust gas flow to a liquid coolant includes a first heat exchange section and a second heat exchange section located adjacent the first heat exchange section. The first heat exchange section is located within a first housing that at least partially encloses a first fluid volume. The second heat exchange section is located within a second housing that at least partially encloses a second fluid volume. A first plurality of heat exchange tubes traverses the first heat exchange section, and a second plurality of heat exchange tubes traverses the second heat exchange section. An exhaust gas flow path of the heat exchanger includes the first fluid volume and the interiors of the second plurality of heat exchange tubes. A coolant flow path of the heat exchanger includes the second fluid volume and the interiors of the first plurality of heat exchange tubes.

Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A cooling system is provided for supplying a coolant flow to a cold plate associated with a processing chip of an electronic device to cool the processing chip. The system includes an electric motor driven fan; a radiator; an accumulator tank connected to the radiator for the transfer of coolant between the accumulator and the radiator; an electric driven pump connected to at least one of the radiator, the accumulator, and the cold plate to provide the coolant flow through the radiator and the cold plate; and a fan shroud adapted to direct the airflow provided by the fan. The fan, the radiator, the accumulator tank, and the pump are mounted on the shroud to be carried thereby, and the pump is located on an exterior side of the of the fan shroud and outside of the radiator and the accumulator tank.

Abstract: A vapor compression cooling system and method (10) is provided for cooling one or more microprocessors (12,14) via one or more cold plates (22,24) mated with the microprocessor(s). Each cold plate (22,24) includes an evaporator (32,34), and the cooling system (10) is designed to operate such that the quality of the refrigerant exiting the evaporator(s) (32,34) is less than 100% so as to maximize the cooling ability of the cold plate(s) (22,24), i.e., to avoid dry-out of the evaporator(s) (32,34). A suction line heat exchanger (26) is provided to protect the compressor (16) of the system (10) by increasing the quality of the refrigerant from the evaporator to at least 100% so as to provide vapor phase refrigerant to the compressor (16).

Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Abstract: A catalytic reactor/heat exchange device (10) is provided for generating a catalytic reaction in a reaction fluid flow (12) and transferring heat to a cooling fluid flow (14). The device includes reaction flow channels (20) with turbulators (30) therein. The turbulators (30) include an initial portion (40) and a selected portion (34) that includes a catalytic layer or coating (36) to initiate the desired catalytic reaction at a location (38) located downstream from the initial portion (40). In some preferred forms, each of the selected portions (34) of the turbulators (30) include at least one downstream section (103, 120) wherein the heat transfer performance has been intentionally reduced to improve performance of the device (10) during start up conditions.

Abstract: A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.

Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Abstract: Rapid response to a fuel cell system of the type including a reformer (32) in response to a change in load is achieved in a system that includes a fuel tank (24), a water tank (20) and a source (42) of a fluid at an elevated temperature. A heat exchanger (28) is provided for vaporizing fuel and water and delivering the resulting vapor to the system reformer (32) and includes an inlet (64) and an outlet (66) for the fluid. It includes a plurality of fluid flow paths (100), (102), (104) extending between the inlet (64) and outlet (66) as well as a fuel inlet (56) and a fuel outlet (58) spaced therefrom. The fuel inlet (56) and outlet (58) are connected by a plurality of fuel flow paths (52) that are in heat exchange relation with the fluid flow paths (100), (102), (104) and the fuel water inlet (56) is located adjacent the upstream ends of the fluid flow paths (100), (102), (104).

Abstract: A vaporizer, a fuel cell system including the vaporizer, and a method of vaporizing fuel in a fuel cell system are disclosed. The fuel cell system includes a fuel reservoir (24) for storing a liquid fuel and a fuel cell (10) for consuming a fuel and generating electricity therefrom. A fuel vaporizer (28) is interposed between the fuel reservoir (24) and the fuel cell (10) for receiving liquid fuel and vaporizing it and delivering it ultimately to the fuel cell (10). The fuel vaporizer (28) includes a heat exchanger which includes a hot fluid inlet (65), a hot fluid outlet (67) and a core (50) interconnecting the inlet (65) and the outlet (68). The core (50) has alternating fuel flow structures (68) and hot fluid structures (69) with the fuel flow structures (68,69) having an inlet (56) and an outlet (58).

Abstract: A compact radiator for a coolant used in cooling an electronic device, including inlet and outlet headers, a plurality of parallel flat tubes defining coolant flow paths between the inlet and outlet headers, and serpentine fins between adjacent tubes. The tubes have a minor dimension in the range of 0.75 mm to 1.2 mm, and the fins have a height in the range of 3 mm to 7 mm. Particularly advantageously, extruded aluminum tubes have a minor dimension of 0.75 mm to 0.85 mm, the fin height of 3.0 mm to 3.25 mm, a tube major dimension on the order of 28 to 32 times the tube minor dimension, and a wall thickness of 0.15 mm to 0.25 mm.

Abstract: Rapid response to a fuel cell system of the type including a reformer (32) in response to a change in load is achieved in a system that includes a fuel tank (24), a water tank (20) and a source (42) of a fluid at an elevated temperature. A heat exchanger (28) is provided for vaporizing fuel and water and delivering the resulting vapor to the system reformer (32) and includes an inlet (64) and an outlet (66) for the fluid. It includes a plurality of fluid flow paths (100), (102), (104) extending between the inlet (64) and outlet (66) as well as a fuel inlet (56) and a fuel outlet (58) spaced therefrom. The fuel inlet (56) and outlet (58) are connected by a plurality of fuel flow paths (52) that are in heat exchange relation with the fluid flow paths (100), (102), (104) and the fuel water inlet (56) is located adjacent the upstream ends of the fluid flow paths (100), (102), (104).

Abstract: A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.

Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.