Patents by Inventor Jonathon Elliott

Jonathon Elliott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interlocked redistribution layer interface for flip-chip integrated circuits
    Patent number: 11545450
    Abstract: This disclosure provides an integrated circuit device that includes a RDL that is interlocked with a bump (or “pillar”). The interlocked interface provides the contact RDL-bump interface with increased structural stability that can better withstand the thermal stresses associated with high performance devices IC devices. The interlock structure mitigates crack/delamination that occurs at the RDL-bump interface in large IC chips that are generally subjected to higher stresses during operation.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: January 3, 2023
    Assignee: NVIDIA CORPORATION
    Inventors: Yuanjing Jane Li, Chuan Zhang, Jonathon Elliott, Howard Marks
  • INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED CIRCUITS
    Publication number: 20220020709
    Abstract: This disclosure provides an integrated circuit device that includes a RDL that is interlocked with a bump (or “pillar”). The interlocked interface provides the contact RDL-bump interface with increased structural stability that can better withstand the thermal stresses associated with high performance devices IC devices. The interlock structure mitigates crack/delamination that occurs at the RDL-bump interface in large IC chips that are generally subjected to higher stresses during operation.
    Type: Application
    Filed: July 16, 2020
    Publication date: January 20, 2022
    Inventors: Yuanjing Jane Li, Chuan Zhang, Jonathon Elliott, Howard Marks